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Heat dissipation device

A heat dissipation device and heat sink technology, applied in the direction of instruments, electrical digital data processing, electrical components, etc., can solve the problems of air flow loss, small wind resistance of memory slots, affecting the normal operation and life of the central processing unit, etc.

Inactive Publication Date: 2014-07-02
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing server system, when the heat of the central processing unit is too high, if it is not dissipated in time and quickly, it may affect the normal operation and life of the central processing unit
On the other hand, the memory slot on the side of the central processing unit has little air resistance, and the airflow flowing to the central processing unit will flow partly to the memory slot so that the airflow is lost.

Method used

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Embodiment Construction

[0012] Please refer to figure 1 A preferred embodiment of the heat dissipation device of the present invention includes a heat sink 10 , a wind guide cover 20 and two fixing pieces 50 . The heat dissipation device is installed on a motherboard 40 in a case (not shown).

[0013] The motherboard 40 is provided with a central processing unit 42 and two sets of memory slots 44 respectively located on two sides of the central processing unit 42 .

[0014] The heat sink 10 includes a base 12 and a plurality of cooling fins 14 vertically disposed on the base 12 . Two screw holes 120 are respectively defined on two sides of the base 12 . Four corners of the base 12 respectively pass through a locking member 16 . The locking pieces 16 can be locked into the motherboard 40 , so that the radiator 10 is installed above the CPU 42 .

[0015] Each fixing member 50 includes a head 52 and a screw 54 disposed at one end of the head 52 . The end of the screw 54 is threaded.

[0016] The w...

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Abstract

A heat dissipation device includes a heat sink and an air duct mounted to the heat sink. The heat sink includes a board and a number of fins extending up from the board. The air duct includes an installation piece pivotably mounted to a side of the heat sink, and a blocking piece extending substantially perpendicularly out from an end of the installation piece.

Description

technical field [0001] The invention relates to a heat dissipation device. Background technique [0002] In the existing server system, when the heat of the central processing unit is too high, the normal operation and lifespan of the central processing unit may be affected if it is not dissipated in time and quickly. On the other hand, the memory slots on the side of the central processing unit have little air resistance, and the airflow flowing to the central processing unit will flow partly to the memory slots so that the airflow is lost. Contents of the invention [0003] In view of the above, it is necessary to provide a cooling device that reduces the air loss of the CPU. [0004] A heat dissipation device, comprising a heat sink for a central processing unit and a wind guide cover rotatably mounted on the heat sink, the heat sink includes a base and a plurality of cooling fins arranged on the top surface of the base , the wind deflector includes a first wind defle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H01L23/467
CPCH01L23/367G06F1/20H01L23/4006H01L23/467H01L2924/0002H01L2924/00
Inventor 汤贤袖
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD