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Evaporating device and evaporating method of substrate

A substrate and evaporation technology, applied in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve problems such as uneven film thickness, and achieve the effect of solving uneven film thickness

Inactive Publication Date: 2014-07-23
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The technical problem to be solved by the present invention is how to solve the problem of uneven film thickness when the existing glass substrate is evaporated using a point evaporation source

Method used

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  • Evaporating device and evaporating method of substrate
  • Evaporating device and evaporating method of substrate
  • Evaporating device and evaporating method of substrate

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Embodiment Construction

[0036] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0037] Such as figure 2 and Figure 4 As shown, a substrate evaporation device of the present invention includes an evaporation source 10, an X-axis moving mechanism, a Y-axis moving mechanism and a Z-axis moving mechanism. Among them, the evaporation source 10 is used to evaporate the substrate 20; the X-axis moving mechanism is used to realize the movement of the evaporation source in the X-axis direction; the Y-axis moving mechanism is used to realize the movement of the evaporation source in the Y-axis direction; the Z-axis moving mechanism It is used to realize the movement of the evaporation source in the Z-axis direction.

[0038] The substrate evaporation devic...

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Abstract

The invention relates to the technical field of evaporation and discloses an evaporating device and an evaporating method of a substrate. The evaporating method comprises the following steps: pre-evaporating the substrate and measuring the thickness distributing condition of an evaporated film, and dividing a thickness area according to the thickness distributing condition of the film; adjusting the distance between an evaporating source and the substrate; and selecting a mobile track of the evaporating source according to the measured thickness distributing condition of the film, and adjusting the thickness of the film of the substrate by moving the evaporating source. The device and method provided by the invention are suitable for a point evaporating source which is shifted from a stationary state to a mobile state, and the moving track of the evaporating source is set according to the thickness distributing condition of the film, so that the point evaporating source moves according to a certain track when being evaporated, so that the non-uniform point film thickness is solved. Meanwhile, the distance between the substrate and the evaporating source is adjustable, so that the pitch time can be shortened by reducing the distance and the utilization ratio of materials can be increased.

Description

technical field [0001] The invention relates to the field of evaporation technology, in particular to a substrate evaporation device and an evaporation method. Background technique [0002] In the manufacturing process of OLED devices (full name: Organic Light-Emitting Diode, Chinese name: Organic Light-Emitting Diode), evaporation is the most critical process. OLED devices need to evaporate photoelectric thin film layers (metal materials) and organic light-emitting diodes on glass substrates. film. [0003] The current evaporation sources are mainly divided into point evaporation sources and line evaporation sources. Due to the high temperature required for cathode evaporation of OLED devices, the industry generally uses point evaporation sources for evaporation. Such as figure 1 As shown, in the process of evaporation, the evaporation source 1 is placed in the shell 2 with the upper opening, the glass substrate 3 is placed on the upper part of the evaporation source, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24C23C14/54
CPCC03C17/001C23C14/24C23C14/243C23C14/545
Inventor 马群元裕太贾敏慧
Owner BOE TECH GRP CO LTD
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