Double-cup surface-mount-device-type LED with light color adjustable and manufacturing process thereof
A patch type, patch technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of inability to control color alone, low brightness, etc., and achieve adjustable color and brightness, convenient adjustment, and remarkable practicability. Effect
Inactive Publication Date: 2014-08-06
山东光因照明科技有限公司
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[0004] The invention provides a double-cup patch LED with adjustable light color and its manufacturing process to solve the problems of low brightness and inability to control the color independently in the prior art
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[0013] like figure 2 As shown, a double-cup SMD LED with adjustable light color includes a SMD bracket, a chip 4 and a gold wire 5. The inside of the SMD bracket is separated into two independent bowls by a double-cup plastic wall 12, and the luminous color is Different chips 4 are respectively fixed in two bowls, and the chips 4 in each bowl are respectively connected to the positive electrode 6 of the chip and the negative electrode 8 of the chip through two gold wires 5, and the other ends of the two gold wires 5 are respectively connected to the inner electrode of the bowl cup. The positive electrode bonding area 7 is connected to the negative electrode bonding area 9, and the LED positive and negative electrode isolation lines 11 are set between the positive electrode bonding area 7 and the negative electrode bonding area 9, and the LED positive pin 14 and the LED positive electrode pin 14 are respectively arranged on both sides of a bowl. Negative pole pin 13, LED posit...
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Provided is a double-cup surface-mount-device-type LED with the light color adjustable. The LED comprises a surface mount device support, wafers and gold wires, wherein the interior of the surface mount device support is partitioned into two independent bowl-shaped cups through a double-cup plastic wall, the wafers with emitted light of different colors are fixedly arranged in the two bowl-shaped cups respectively, the wafer in each bowl-shaped cup is connected with a wafer positive electrode and a wafer positive electrode through two gold wires respectively, the other ends of the two gold wires of each wafer are connected with a positive electrode wire bonding area and a negative electrode wire bonding area of the corresponding bowl-shaped cup respectively, an LED positive electrode and negative electrode shielding wire is arranged between each positive electrode wire bonding area and the corresponding negative electrode wire bonding area, an LED positive electrode pin and an LED negative electrode pin are arranged on the two sides of each bowl-shaped cup respectively, and a polarity mark is arranged at one corner of the surface mount device support. According to the double-cup surface-mount-device-type LED with the light color adjustable, due to the facts that the two bowl-shaped cups are arranged in the surface mount device support, the two wafers with emitted-light of different colors are fixed, and each wafer is connected with the corresponding independent positive electrode pin and the corresponding independent negative electrode pin, the overall emitted-light color of a lamp bead can be adjusted by having control over the positive electrode pins and the negative electrode pins of the surface mount device support, the two wafers can emit light independently, and can also emit light at the same time, and when the two wafers emit light at the same time, the color of the LED is the mixed the colors of the two wafers.
Description
technical field [0001] The invention relates to the technical field of LED lighting, in particular to a double-cup patch LED with adjustable light color and a manufacturing process thereof. Background technique [0002] At present, the SMD lamp beads are all single-cup, a single chip emits light, and the structure is as attached figure 1 As shown, it is composed of brackets, chips, gold wires, phosphors (only available in white light), and AB glue; the light-emitting chip of LED is a semiconductor wafer, one end of the wafer is fixed on the bowl cup through crystal-bonding glue, and the other end is The negative pole, the other end is connected to the positive pole of the power supply, and is connected to the bowl cup through a gold wire. [0003] The brightness of the existing SMD LED lamp beads is low, and the luminous color cannot be controlled independently, and the color cannot be adjusted or is inconvenient to adjust. Contents of the invention [0004] The inventio...
Claims
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IPC IPC(8): H01L25/075H01L33/62
CPCH01L2224/48091H01L2224/48247H01L2224/48257H01L2924/00014
Inventor 张玉勉
Owner 山东光因照明科技有限公司