Tempered glass substrate marking method and marking device

A technology for strengthening glass and substrates, which is applied in glass cutting devices, glass production, glass manufacturing equipment, etc., and can solve problems such as easy wear and tear of cutter wheels

Inactive Publication Date: 2014-08-13
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But on the other hand, the front end of the cutter wheel collides with the end of the substrate, so there may be a gap at the end of the substrate, irregular breakage from the end due to the influence of tensile stress inside the substrate, or full cutting (completely broken). ) etc.
In addition, the cutter wheel is also prone to wear due to collision with the edge part

Method used

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  • Tempered glass substrate marking method and marking device
  • Tempered glass substrate marking method and marking device
  • Tempered glass substrate marking method and marking device

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Embodiment Construction

[0047] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation of the marking method and marking device for a strengthened glass substrate proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments , method, step, structure, feature and effect thereof, detailed description is as follows.

[0048] figure 1 It is a schematic diagram showing an example of a scribing apparatus used to form a scribe line on a strengthened glass substrate having a compressive stress layer on the substrate surface.

[0049] This scribing apparatus SC includes a stage 3 on which a strengthened glass substrate M is placed. The stage 3 is provided with a holding mechanism for holding the substrate M placed thereon at a fixed position. In this embodiment, as the holding mechanism, the substrate M is sucked and held b...

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Abstract

The invention relates to a tempered glass substrate marking method and a marking device capable of enabling a tempered glass substrate to be provided with marking lines by using an internally tangent method. A resolving means is that a marking method for processing a marking line on the tempered glass substrate (M) the surface of which a compressed stress layer is formed comprises: irradiating a laser beam on the surface of the substrate (M) at a position closer to an inner side than one end of the substrate (M), forming a trigger trench (T) becoming the marking start point of a cutter wheel (2) in virtue of the irradiated trace, then abutting the cutter wheel (2) against the trigger trench (T) and pressing and rotating the surface of the substrate (M) by using the trigger trench (T) as a start point so as to form a marking line.

Description

technical field [0001] The present invention relates to a scribing method and scribing device for a glass substrate made of tempered glass. Here, the "strengthened glass" is glass manufactured such that a compressive stress layer in which compressive stress remains is formed on the substrate surface layer of the glass substrate and tensile stress remains inside the substrate. Strengthened glass has the property that it is not easily cracked by external force due to the influence of the compressive stress layer, but on the contrary, once a crack occurs on the surface of the substrate and progresses to the inside of the substrate where residual tensile stress exists, the crack will be reversed. Easy to deepen soaking. Background technique [0002] In general, in the process of breaking a glass substrate, a step of first forming a scribed line of limited depth on the surface of the substrate, followed by a breaking rod or a breaking roller along the scribed line from the back ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/02
CPCB23K26/38C03B33/027C03B33/033C03B33/072C03B33/082C03B33/091Y02P40/57
Inventor 富永圭介
Owner MITSUBOSHI DIAMOND IND CO LTD
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