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3dic package including perforated foil

A technology for encapsulating components and foils, which is applied to electrical components, electrical solid-state devices, semiconductor devices, etc., and can solve problems such as unsatisfactory thermal conductivity

Active Publication Date: 2016-12-28
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of TIM is not satisfactory
Therefore, heat dissipation through the TIM becomes a bottleneck to improve heat dissipation

Method used

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  • 3dic package including perforated foil
  • 3dic package including perforated foil
  • 3dic package including perforated foil

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Embodiment Construction

[0036] The making and using of various embodiments of the invention are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable concepts that can be implemented in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways to make and use the invention, and do not limit the scope of the invention.

[0037] Packages including Perforated Foil Sheets (PFS) and methods of forming the same are provided according to various exemplary embodiments. Intermediate stages in forming the package are shown. Package variations according to alternative embodiments are discussed. Like reference numerals are used to refer to like elements throughout the several views and illustrative embodiments.

[0038] Figure 1A and Figure 1B The top view and cross-sectional view of PFS20 are shown, respectively, where, Figure 1B The cross-sectional view in is given by Figure 1A Obtained...

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PUM

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Abstract

The invention relates to a 3DIC packaging member comprising a perforated foil sheet, the structure comprises a thermal interface material and the perforated foil sheet (PFS), the PFS comprises via holes arranged in the PFS, a first part of the PFS is inserted in the thermal interface material, the upper layer of the thermal interface material is arranged above the PFS, the lower layer of the thermal interface material is arranged below the PFS, and the via holes are filled with the thermal interface material.

Description

technical field [0001] The present invention relates to the field of semiconductors, and more particularly, the present invention relates to a 3DIC package comprising a perforated foil. Background technique [0002] In three-dimensional integrated circuits (3DICs), device dies are either bonded on interposers, packaging substrates, or stacked on top of other device dies. Although the performance of the corresponding circuits is improved, heat dissipation becomes a more serious problem. Traditionally, heat in the device die is dissipated to an overlying heat sink through a layer of thermal interface material (TIM), which adheres the heat sink to the underlying device die. However, the thermal conductivity of TIM is not satisfactory. Therefore, heat dissipation through the TIM becomes a bottleneck for improving heat dissipation. Contents of the invention [0003] In order to solve the problems existing in the prior art, according to one aspect of the present invention, a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367
CPCH01L2224/16225H01L2224/32225H01L2224/73204
Inventor 洪文兴
Owner TAIWAN SEMICON MFG CO LTD