Integrated circuit module and packaging assembly thereof

Abstract

The invention discloses an integrated circuit module and a packaging assembly of the integrated circuit module. The integrated circuit module comprises a semiconductor bare chip, a first insulation layer and i power buses, wherein the semiconductor bare chip comprises a plurality of electronic devices which are divided into m sets, each electronic device comprises n electrodes with different polarities, and m and n are both integers larger than one; the first insulation layer is located on the surface of the semiconductor bare chip; the i power buses comprise a plane extending portion located on the first insulation layer and a plurality of perpendicular channel portions which penetrate through the first insulation layer and are connected with all electrodes of the devices, i is an integer larger than one and smaller than or equal to m*n, one electrode of each device in at least two electronic devices and one electrode of another device in at least two electronic devices are electrically connected through at least one power bus among the i power buses, and each power bus among the i power buses is connected to an external connecting terminal. By the adoption of the integrated circuit module, a lead frame with a finger-shaped lead fin is omitted, so that the design of the lead frame is simplified, the interconnection resistance is reduced, and heat dissipation performance is improved.

Description

technical field [0001] The present invention relates to a semiconductor packaging assembly, and more particularly to an integrated circuit assembly and packaging assembly applied to a switching regulator. Background technique [0002] Switching regulators, such as DC-DC converters, are used to provide a stable voltage source for a variety of electrical systems. High-efficiency DC-DC converters are especially required for battery management in low-power devices (such as laptops, cell phones, etc.). Switching regulators convert the input DC voltage to a high frequency voltage, and then filter the high frequency output voltage to convert it to a DC output voltage. [0003] figure 1 A circuit schematic of a typical switching regulator 10 is shown. The switching regulator includes a control stage and a power stage. The control stage includes the control chip U1. The power stage includes power devices Q1 and Q2. Power devices are, for example, field effect transistors or bip...

AI Technical Summary

Problems solved by technology

[0006] In view of this, the object of the present invention is to provide an integrated circuit assembly and its packaging assembly, to solve the problem that the electrical connection of multiple electronic devices adversely affects its performance

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