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A kind of high performance and high stability nano solder paste and preparation method thereof

A nano-welding, high-stability technology, applied in the field of fine chemicals, can solve the problems of insufficient production process, easy drying stability, easy to generate air bubbles, etc., to achieve the effect of enhancing cleaning ability, improving anti-oxidation ability and improving stability

Active Publication Date: 2015-12-02
GUANGZHOU BOSHIDA NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the field of high-end and high-density assembly, such as: high-end mobile phones, digital cameras, precision instruments, etc., during the welding process of printed circuit boards, compared with similar foreign products, there are still common problems such as air bubbles, virtual welding, continuous welding, and easy to use. Dryness (poor stability) and other problems, one of the reasons is that foreign solder paste production equipment is relatively better, but the main reason is that there are still serious deficiencies in product formula and related production processes in China

Method used

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  • A kind of high performance and high stability nano solder paste and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] (1) 0.2g initiator (benzoyl peroxide) is dissolved in 20g organic solvent (toluene), obtains initiator solution; Add 2g of methyl methacrylate, 4g of butyl acrylate, 2g of acrylic acid, 1g of vinyltriethoxysilane, 3g of hexafluorobutyl methacrylate, 5g of toluene and 5g of methyl ethyl ketone into the bottle. , stirring and mixing to obtain a mixed solution; under the protection of nitrogen, the temperature was raised to 90 ° C, the aforementioned initiator solution was added dropwise to the mixed solution, and the temperature was kept for 1 hour to obtain a silicone-modified acrylic resin;

[0049] (2) Mix the silicone-modified acrylic resin obtained in step (1) with organic solvent B (diethylene glycol ethyl ether) and place in a reaction kettle to heat and stir until completely melted, and keep warm for 10 minutes; add thixotropic agent in sequence (hydrogenated castor oil), activator (glutaric acid) and wetting agent (cetyltrimethylammonium bromide), stirred for 15 ...

Embodiment 2

[0052] (1) 0.8g initiator (di-tert-butyl peroxide) is dissolved in 22g organic solvent dimethylbenzene, obtains initiator solution; Add 2.5g methyl methacrylate, 4g butyl acrylate, 3g acrylic acid, 2g dimethyl vinyl chlorosilane, 3g hexafluorobutyl methacrylate, 5g toluene and 6g butyl acetate to form the mixed solvent in the bottle successively, Stir and mix to obtain a mixed solution; raise the temperature to 90°C under nitrogen protection, add the aforementioned initiator solution dropwise to the mixed solution, and keep it warm for 1.5 hours to obtain a silicone-modified acrylic resin;

[0053] (2) Mix the silicone-modified acrylic resin obtained in step (1) with the organic solvent B [1-(3-aminopropyl)-2-pyrrolidone], put it in a reaction kettle, heat and stir until completely melted, and keep warm 15 minutes; Add thixotropic agent (dodecyl hydroxystearic acid), activator (pimelic acid) and wetting agent (sodium diisobutyl succinate sulfonate) successively, stir for 12 mi...

Embodiment 3

[0056] (1) 0.5g initiator (di-tert-butyl peroxide) is dissolved in 21g organic solvent (acetone), obtains initiator solution; Add 4g methyl methacrylate, 3.5g butyl acrylate, 4g acrylic acid, 2g dimethylvinyl chlorosilane, 3g hexafluorobutyl methacrylate and 5g toluene and 5g butyl acetate mixed solvent in the mouth bottle successively, stir Mix well to obtain a mixed solution; raise the temperature to 95° C. under the protection of nitrogen, drop the aforementioned initiator solution into the mixed solution, and keep it warm for 1 hour to obtain a silicone-modified acrylic resin;

[0057] (2) Mix the organosilicon-modified acrylic resin obtained in step (1) with organic solvent B (butyl acetate) and place in a reaction kettle to heat and stir until completely melted, and keep warm for 10 minutes; add the thixotropic agent gas phase two Silicon oxide particles (average particle size is 20nm) and hydrogenated castor oil (gas-phase silica particles and hydrogenated castor oil in...

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Abstract

The invention discloses a high-performance high-stability nanometer soldering paste and a preparation method of the high-performance high-stability nanometer soldering paste. The soldering paste is composed of 10-22 percent of scaling powder and 78-90 percent of lead-free soldering powder. Methyl methacrylate, butyl acrylate, acrylic acid, silicon-containing monomer, hexafluorobutyl methacrylate and organic solvents are mixed to obtain a mixed solution; an initiator solution is dripped into the mixed solution under nitrogen protection at 90-100 DEG C, and silicone-modified acrylic resin is obtained after reaction; the organic solvents are used for dissolving the silicone-modified acrylic resin, thixotropic agents, activators and wetting agents are added and stirred, and the scaling powder is obtained; the cooled scaling powder and the lead-free soldering powder are arranged in a nanometer grinding machine to be ground until the particle diameter is 100-500 nanometers, and the nanometer soldering paste is obtained. The nanometer soldering paste will not generate air bubbles and the problems of insufficient soldering, continuous soldering and the like in the welding process, and the cleaning capacity of the soldering paste for metallic oxide and adaptability to high-density assembly are improved.

Description

technical field [0001] The invention belongs to the field of fine chemicals, in particular to a high-performance and high-stable nano solder paste and a preparation method thereof. Background technique [0002] At present, the domestic printed circuit board (PCB) solder paste has been able to achieve good applications in low-end products, such as: environmental protection, good anti-oxidation ability; certain thixotropy and viscosity retention ability; excellent heat resistance Collapse ability and solder joints are bright, full and even. However, in the field of high-end and high-density assembly, such as: high-end mobile phones, digital cameras, precision instruments, etc., in the welding process of printed circuit boards, compared with similar foreign products, there are still common problems such as air bubbles, virtual welding, continuous welding, and easy to use. Dryness (poor stability) and other problems, one of the reasons is that foreign solder paste production eq...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363C08F220/18C08F220/22C08F220/14C08F220/06C08F230/08
CPCB23K35/262B23K35/3613B23K35/362
Inventor 周辉周武艺
Owner GUANGZHOU BOSHIDA NEW MATERIAL