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A kind of high temperature resistant thermosetting shape memory polyimide and preparation method thereof

A polyimide, warming technology, applied in the field of smart material shape memory polymers, can solve the problems of SMP thermal stability and low thermodynamic performance at high temperature, and achieve excellent heat resistance, fast recovery rate, and small modulus change Effect

Active Publication Date: 2016-05-04
冷劲松
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is in order to solve the current still T g Thermosetting SMP at 235-245°C, and the thermal stability and high-temperature thermodynamic properties of the currently prepared SMP are low, so a preparation method for high-temperature-resistant thermosetting shape-memory polyimide material is provided

Method used

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  • A kind of high temperature resistant thermosetting shape memory polyimide and preparation method thereof
  • A kind of high temperature resistant thermosetting shape memory polyimide and preparation method thereof
  • A kind of high temperature resistant thermosetting shape memory polyimide and preparation method thereof

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specific Embodiment approach 1

[0038] Specific embodiment one: a kind of high temperature resistant thermosetting shape memory polyimide of this embodiment, its structural formula is:

[0039]

[0040] Wherein, the n is 62-155, and the molecular weight of the polyimide between two triamino cross-linking agent molecules of the high-temperature-resistant thermosetting shape-memory polyimide is 42.3-105.9 kg / mol.

specific Embodiment approach 2

[0041] Specific embodiment two: this embodiment is the same as specific embodiment one: the n is 80-120, the high temperature resistant thermosetting shape memory polyimide is between two triamino crosslinking agent molecules The molecular weight of polyimide is 50-100kg / mol. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0042] Specific embodiment three: a kind of preparation method of high temperature resistant thermosetting shape memory polyimide of the present embodiment, it is carried out according to the following steps:

[0043] 1. Weigh 4,4'-diaminodiphenyl ether diamine monomer into a three-necked flask containing N,N-dimethylacetamide solvent, stir for 30 minutes under the protection of dry nitrogen and room temperature, until completely dissolved , to obtain a solution; wherein, the volume molar ratio of N,N-dimethylacetamide solvent to 4,4'-diaminodiphenyl ether diamine monomer is 1mL: (0.2~0.3)mmoL;

[0044] 2. Weigh the bisphenol A diether dianhydride monomer, and add the bisphenol A diether dianhydride monomer into the solution obtained in step 1 in 4 to 6 times to make 4,4'-diaminodiphenyl The amount of ether diamine monomer substance is 86.5-95.5% of the amount of bisphenol A diether dianhydride monomer substance, and then at room temperature, stir at a stirring speed of 250r / m...

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Abstract

The invention relates to high-temperature-resistant thermoset shape memory polyimide and a preparing method of the high-temperature-resistant thermoset shape memory polyimide. The method solves the problems that according to an existing method, thermoset SMP with the Tg larger than 230 DEG C cannot be prepared and currently-prepared polyimide is poor in thermal stability, mechanical property and shape memory performance. The structural formula of the polyimide can be seen in the specification. The preparing method comprises the steps that 1, a diamine solution is prepared; 2, polyamide acid with the large molecular weight of the anhydride seal end is prepared; 3, thick sol gel is prepared; 4, the high-temperature-resistant thermoset shape memory polyimide is prepared. The Tg of the prepared high-temperature-resistant thermoset shape memory polyimide ranges from 235 DEG C to 245 DEG C, the shape memory effect of the high-temperature-resistant thermoset shape memory polyimide is guaranteed, and the high-temperature-resistant thermoset shape memory polyimide can be applied to the high temperature field.

Description

technical field [0001] The invention relates to a method for preparing a high-temperature-resistant thermosetting shape-memory polyimide material, specifically a method for preparing a thermosetting shape-memory polyimide with a glass transition temperature of 235-245°C, which belongs to the shape of intelligent materials The field of memory polymers. Background technique [0002] Shape memory polymer (shapememorypolymer, SMP) refers to a polymer material that has an initial shape, and after being deformed and fixed under certain conditions, it can sense and respond to external stimuli to restore its original state. Compared with the 8% reversible strain of shape memory alloy, SMP not only has ≥100% reversible strain, but also has the advantages of low density, easy processing and easy control of shape recovery temperature. play an increasingly important role. Various SMP materials such as shape-memory polyurethane, shape-memory polystyrene, and shape-memory epoxy resin ha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10
Inventor 冷劲松肖鑫礼刘彦菊孔德艳
Owner 冷劲松
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