A kind of high temperature resistant long life shape memory polyimide and preparation method thereof

A polyimide, long-life technology, applied in the field of polyimide and its preparation, to achieve the effect of excellent heat resistance, excellent thermodynamic performance, and long life

Active Publication Date: 2018-09-07
哈尔滨哈船融阳材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that there is no T g The problem of long-life shape-memory polyimide with more than thousands of times of use at 230°C is to provide a high-temperature-resistant long-life shape-memory polyimide and its preparation method

Method used

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  • A kind of high temperature resistant long life shape memory polyimide and preparation method thereof
  • A kind of high temperature resistant long life shape memory polyimide and preparation method thereof
  • A kind of high temperature resistant long life shape memory polyimide and preparation method thereof

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specific Embodiment approach 1

[0044] Specific implementation mode 1: This implementation mode is a high-temperature-resistant long-life shape memory polyimide whose structural formula is:

[0045]

[0046] Wherein, the value range of n is 15-27.

specific Embodiment approach 2

[0047] Specific implementation mode 2: This implementation mode is a preparation method of high-temperature-resistant and long-life shape memory polyimide, which is completed according to the following steps:

[0048] 1. Add 4,4'-bis(4-aminophenoxy)biphenyl into the aprotic polar solvent, and then stir until 4,4'-bis(4-aminophenoxy)biphenyl Benzene is completely dissolved to obtain a diamine solution;

[0049] The volume ratio of the amount of 4,4'-bis(4-aminophenoxy)biphenyl described in step 1 to the aprotic polar solvent is (0.18mmoL-0.3mmoL): 1mL;

[0050]2. Add the bisphenol A type diether dianhydride monomer into the diamine solution obtained in step 1 in 4 to 6 times, and then stir the reaction at room temperature and at a stirring speed of 250r / min to 550r / min. 15h to 30h, to obtain an anhydride-terminated polyamic acid with a large molecular weight;

[0051] The molar ratio of 4,4'-bis(4-aminophenoxy)biphenyl to bisphenol A diether dianhydride monomer in the diamine...

specific Embodiment approach 3

[0066] Specific embodiment three: the difference between this embodiment and specific embodiment two is: the aprotic polar solvent described in step one is N,N-dimethylformamide, N,N-dimethylacetamide or N-methylpyrrolidone. Other steps are the same as in the second embodiment.

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Abstract

The invention provides high-temperature-resistant long-service-life shape memory polyimide and a preparation method thereof, and relates to polyimide and a preparation method of the polyimide. The invention aims at solving the problem that no long-service-life shape memory polyimide with the Tg exceeding 230 DEG C and the use times exceeding thousands of times exists in the prior art. The high-temperature-resistant long-service-life shape memory polyimide has a structural formula shown as the accompanying drawing. The preparation method comprises the following steps of 1, preparing a diamine solution; 2, preparing anhydride end sealing molecular weight polyamic acid; 3, preparing bubble-free viscous sol-gel; 4, performing gradient temperature rise to obtain the high-temperature-resistant long-service-life shape memory polyimide. By using the method, the high-temperature-resistant long-service-life shape memory polyimide can be obtained.

Description

technical field [0001] The invention relates to a polyimide and a preparation method thereof. Background technique [0002] Shape memory materials refer to intelligent materials that have an initial shape, and after being deformed and fixed under certain conditions, can sense and respond to external changes in stimuli and restore their original state. Shape memory alloy (SMA) and shape memory polymer (SMP) are common shape memory materials, and SMA has been widely used in many fields such as satellite antennas. Compared with the small reversible strain of SMA (generally less than 8%), SMP not only has a reversible strain of ≥100%, but also has the advantages of low density, easy processing and easy control of shape recovery temperature. Aerospace and many other fields are playing an increasingly important role. Shape memory polyimide combines the shape memory effect with the excellent performance of polyimide, and is widely used in flexible optoelectronic devices and high ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08J5/18
CPCC08G73/1042C08G73/1071C08J5/18C08J2379/08
Inventor 孔德艳肖鑫礼
Owner 哈尔滨哈船融阳材料科技有限公司
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