Three-dimensional light-emitting diode device and LED lamp good in heat conduction effect
A technology of light-emitting diodes and devices, applied in the field of three-dimensional light-emitting diode devices, can solve the problems of slow heat conduction, large thermal resistance of aluminum substrates, affecting the life of LEDs, etc., and achieve the effect of reducing thermal resistance and prolonging life.
Active Publication Date: 2014-09-03
魏展生
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Problems solved by technology
[0002] Existing LED packages are generally in a planar mode, and the light emitted by this mode is unidirectional. Even if there are three-dimensional and multi-faceted products, their structures are mostly made of substrates, and the substrates are usually made of aluminum substrates. The thermal resistance of aluminum substrates Large, slow heat conduction, thus increasing LED light decay and affecting LED life
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[0036] The first embodiment of the present invention, such as Figure 1-12 As shown, the heat conduction plate 4 is an electric conduction heat conduction plate, and a slot 41 is opened on the heat conduction plate 4, and a conduction heat conduction sheet 42 is separated in the lack slot 41, and the conduction heat conduction sheet 42 forms the Circuit 5, the chip 2 is electrically connected to the conductive and heat-conducting sheet 42, and the chip is fixed on the conductive and heat-conducting plate. The bracket 1 described in the present invention is stamped and formed by copper, and the thin copper sheet is punched into a cross-shaped thin copper sheet, wherein the cross-shaped thin copper sheet includes a middle heat conduction plate 4 and heat conduction plates connected to the four sides of the middle heat conduction plate 4. plate 4, forming a number of slots 41 on the cross-shaped thin copper sheet, and electrically and heat-conducting sheets 42 are separated in th...
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The invention discloses a three-dimensional light-emitting diode device and an LED lamp good in heat conduction effect. The three-dimensional light-emitting diode device comprises a support, wherein the support comprises a plurality of light-emitting faces used for installing wafers, heat conductive plates and circuits are arranged on the light-emitting faces respectively, and the wafers are arranged on the heat conductive plates and electrically connected with the circuits. The LED lamp comprises a lamp cap, wherein a radiator is arranged on the lamp cap, the three-dimensional light-emitting diode device is arranged on the upper end face of the radiator, and the circuits are electrically connected with a driving power source and the lamp cap. As is shown in one purpose, the three-dimensional light-emitting diode device is simple in structure, light is emitted through multiple faces, direct heat conduction is achieved, stability and reliability of an LED light source body can be improved, the service life of the LED light source body is further prolonged, and the heat conduction effect of the three-dimensional light-emitting diode device is good. As is shown in the other purpose, the LED lamp good in heat conduction effect comprises the three-dimensional light-emitting diode device.
Description
technical field [0001] The present invention relates to a three-dimensional light-emitting diode device, and also relates to an LED lamp with good heat conduction effect comprising the above-mentioned three-dimensional light-emitting diode device. Background technique [0002] Existing LED packages are generally in a planar mode, and the light emitted by this mode is unidirectional. Even if there are three-dimensional and multi-faceted products, their structures are mostly made of substrates, and the substrates are usually made of aluminum substrates. The thermal resistance of aluminum substrates Large, slow heat conduction, thereby increasing the LED light decay and affecting the life of the LED. [0003] Therefore, the existing light-emitting diode devices need to be further improved. Contents of the invention [0004] The purpose of the present invention is to overcome the deficiencies in the prior art, provide a simple structure, multi-faceted light direct heat conduc...
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IPC IPC(8): F21S2/00F21V19/00F21V29/00F21Y101/02F21K9/232F21K9/238F21Y107/40F21Y115/10
Inventor 魏展生叶国光唐运忠
Owner 魏展生