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A large mask template surface compensation device for lithography equipment

A technology of compensation device and lithography equipment, which is applied in the direction of microlithography exposure equipment, photolithography exposure device, etc., can solve the problems of self-weight deformation of large mask plates, etc., and achieve the goal of improving compensation efficiency, improving imaging quality, and good adsorption effect Effect

Active Publication Date: 2016-08-24
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the defects existing in the prior art, the present invention proposes a new large mask surface compensation device, which solves the self-weight deformation of the large mask in the step-and-scan lithography machine without changing the existing hardware structure Compensation problem, so that the self-weight deformation in the field of view of the object side can be effectively controlled during the whole scanning movement of the mask, without the need to adjust the object surface through the objective lens

Method used

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  • A large mask template surface compensation device for lithography equipment
  • A large mask template surface compensation device for lithography equipment
  • A large mask template surface compensation device for lithography equipment

Examples

Experimental program
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no. 1 example

[0039] Figure 4 It is the first embodiment of the structure of the photolithography system and the compensation device for the large mask template of the present invention.

[0040] Figure 4 The surface compensation device of the illustrated embodiment is located between the lighting unit 1 of the lithography machine and the mask plate 2 , and includes: a glass plate 6 , a support frame for the glass plate, and an exhaust control unit 9 .

[0041] The transparent glass plate 6 is located above the mask plate 2 and arranged parallel to the mask plate 2 , and a number of extraction holes 8 are provided on the glass plate 6 . The glass plate 6 is fixedly arranged relative to the objective lens group 4 and at least covers the current exposure area of ​​the mask plate 2 .

[0042] The exhaust control unit 9 is connected to the exhaust hole 8 through the exhaust pipeline 10, which exhausts the gap between the glass plate 6 and the mask plate 2 through the exhaust hole 8, and for...

no. 2 example

[0051] Figure 5a with Figure 5b It is the second embodiment of the large mask surface compensation device of the present invention.

[0052] Figure 5a with Figure 5b The surface compensation device of the illustrated embodiment is located between the lighting unit of the lithography machine and the mask plate 2, and includes: a glass plate 6, a glass plate support frame 7, and an exhaust control unit.

[0053] The transparent glass plate 6 is located above the mask plate and arranged parallel to the mask plate, and the glass plate 6 is provided with a number of extraction holes. The glass plate 6 is fixedly arranged relative to the objective lens group, and at least covers the current exposure area of ​​the mask plate.

[0054] The exhaust control unit is connected to the exhaust hole through the exhaust pipeline, which exhausts the gap between the glass plate 6 and the mask plate through the exhaust hole, and forms a pressure difference between the upper and lower sur...

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Abstract

The invention discloses a large mask surface type compensation device for photolithography equipment, which is located between an illumination unit and a mask, and comprises: a glass plate provided with several extraction holes and an extraction control unit; the glass plate Located above the mask, parallel to the mask; the glass plate is fixedly arranged relative to the objective lens group, and at least covers the current exposure area of ​​the mask; the extraction control unit controls the glass plate and the mask through the extraction hole The gap between them is pumped, and a pressure difference is formed between the upper and lower surfaces of the mask to compensate the self-weight deformation of the mask. Compared with the prior art, the present invention solves the problem of self-weight deformation compensation of a large mask in a step-and-scan lithography machine without changing the existing hardware architecture, so that the mask can be viewed from the object side during the entire scanning movement process. The self-weight deformation in the field is effectively controlled, and there is no need to adjust the object plane through the objective lens.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit equipment manufacturing, in particular to a large mask template surface compensation device for photolithography equipment. Background technique [0002] With the increase in the size of the thin film field effect transistor TFT substrate, the size of the mask of the TFT lithography machine has also increased accordingly. From the original 6-inch mask to the 5.5th generation of TFT lithography technology, the size of the mask has reached 920mm×800mm , to the 8.5th generation mask size has reached an astonishing 1320mm 1108mm. Such a "huge" mask plate, adsorbed on the mask table, will inevitably be affected by its own weight and deform vertically (up to 40um or more), such as figure 1 shown. For high-generation TFT lithography equipment above the 5.5th generation, multi-lens splicing (Nikon) or ultra-large field of view (Canon) technology is an inevitable trend, and the self-weig...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 许琦欣龚辉
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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