Insulating and thermally conductive sheet

A technology of insulation and heat conduction and high heat conduction, which is applied in semiconductor devices, cooling/ventilation/heating transformation, semiconductor/solid-state device components, etc., and can solve problems such as heat conduction resistance, fiber uprightness not required, and high penetration density cannot be obtained. , to achieve the effect of ensuring the reliability of the insulation

Inactive Publication Date: 2014-09-03
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, this prior art has a problem that sufficient thermal conductivity cannot be obtained due to the presence of a binder resin with low thermal conductivity, voids in the filler gap, which hinders thermal conduction
However, the existing electrostatic flocking described in Non-Patent Document 5 is generally used as a production technology for raising materials such as clothes, carpets, and heat insulating materials, and does not require extreme verticality of fibers, and simultaneously contains a large amount of inclined fibers
Therefore, when using the existing electrostatic flocking technology to manufacture insulating and high thermal conductivity sheets, because the inclined fibers cannot penetrate the thickness direction of the sheet, high penetration density cannot be obtained

Method used

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  • Insulating and thermally conductive sheet
  • Insulating and thermally conductive sheet
  • Insulating and thermally conductive sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0118] The thermal conductivity of ZylonHM(R) (manufactured by Toyobo Co., Ltd.) in the fiber axis direction was 40 W / mK. ZylonHM(R) cut to a length of 400 μm was used as insulating high-thermal-conductive fiber, and liquid silicone rubber main agent TSE3431-A / 100 parts by mass manufactured by Momentive Performance Materials Inc., Momentive Performance Materials was used as the binder resin solution. The liquid silicone rubber curing agent TSE3431-C manufactured by Inc. was mixed with 30 parts by mass of the resin solution. As an adhesive, a 10 wt.% aqueous solution of polyvinyl alcohol AH-26 (manufactured by Nippon Synthetic Chemicals) was used. As the base material, an aluminum foil with a thickness of 11 μm was used. A binder resin solution with a thickness of 25 μm was coated on the substrate on the positive electrode plate, and placed on top of the ground electrode plate provided with Zylon short fibers. The electrode spacing was set at 3 cm. Electrostatic flocking was...

Embodiment 2

[0120] As the binder resin solution, Toyobo Co., Ltd. saturated copolyester polyurethane solution UR3600 / 80.9 parts by weight, Toyobo Co., Ltd. saturated copolyester polyurethane solution BX-10SS / 12.0 parts by weight, Toyobo Co., Ltd. A Zylon complex ester urethane resin sheet was produced in the same manner as in Example 1 except that the epoxy resin AH-120 manufactured by the company was mixed with 7.1 parts by weight of the liquid. In addition, the sheet is in a semi-cured state in this state. The penetration density of the fibers was 26%. In actual use, the sheet in the semi-cured state is bonded to the exothermic body and the cooling body, and heated at 140°C for 4 hours to make it completely cured before use, so the volume resistivity is measured in the completely cured state. The volume intrinsic resistance of the fully cured sheet is 10 16 More than Ω·cm (measuring equipment exceeds the range).

Embodiment 3

[0122] As the binder resin liquid, a liquid obtained by mixing saturated copolyester polyurethane solution UR3575 / 100 parts by weight manufactured by Toyobo Co., Ltd. and epoxy resin HY-30 / 2.4 parts by weight manufactured by Toyobo Co., Ltd. was used. In addition, a Zylon complex ester polyurethane resin sheet was produced in the same manner as in Example 1. In addition, the sheet is in a semi-cured state in this state. The penetration density of the fiber is 26%, the volume inherent resistance of the sheet is 10 16 More than Ω·cm (measuring equipment exceeds the range).

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Abstract

[Problem] To provide a high heat dissipation sheet that enables electrical insulation properties while also making possible a simple construction method. [Solution] In the present invention, short fibers with electrical insulation properties and high heat dissipation properties are electrostatically flocked at high density onto a base material coated with adhesive, under conditions that allow for high density electrostatic flocking, the erect short fibers are adhered and affixed, binder resin is impregnated and is hardened, and subsequently one surface of the sheet is polished so that the insulating and highly-thermally-conductive fibers penetrate and are arrayed at high density in the direction of the sheet thickness. As a result, a heat dissipation sheet is formed in which the fibers protrude from one surface while the opposite surface is made smooth so that heat from a heat generating body can be quickly absorbed by the opposite surface and quickly dissipated into the air by the fiber protrusion surface.

Description

technical field [0001] The present invention relates to an insulating high thermal conductivity sheet which is electrically insulating and has high heat dissipation. More specifically, it relates to an insulating highly thermally conductive sheet capable of efficiently dissipating heat from heat radiators such as electronic substrates, semiconductor chips, and light sources while ensuring insulation reliability. Background technique [0002] As electronic devices become thinner, smaller, and more powerful, the importance of heat dissipation measures has increased. As a method of dissipating heat from heat radiating bodies such as semiconductors and LEDs, metal heat radiating bodies such as aluminum and copper are usually attached. However, metals generally have electrical conductivity, and when insulation is required, an insulator is inserted between the radiator and the radiator to maintain insulation. Here, what poses a big problem is that insulators generally have low t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373B29D7/01H05K7/20
CPCH01L2924/0002B29D7/01H05K7/20481B29C70/382B29C70/88H01L23/3737H01L23/3733H01L23/3735B05D1/16Y10T428/24355H01L2924/00012H01L2924/00B05D5/00
Inventor 西村浩和桥本香菜
Owner TOYOBO CO LTD
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