Insulating and thermally conductive sheet

Abstract

[Problem] To provide a high heat dissipation sheet that enables electrical insulation properties while also making possible a simple construction method. [Solution] In the present invention, short fibers with electrical insulation properties and high heat dissipation properties are electrostatically flocked at high density onto a base material coated with adhesive, under conditions that allow for high density electrostatic flocking, the erect short fibers are adhered and affixed, binder resin is impregnated and is hardened, and subsequently one surface of the sheet is polished so that the insulating and highly-thermally-conductive fibers penetrate and are arrayed at high density in the direction of the sheet thickness. As a result, a heat dissipation sheet is formed in which the fibers protrude from one surface while the opposite surface is made smooth so that heat from a heat generating body can be quickly absorbed by the opposite surface and quickly dissipated into the air by the fiber protrusion surface.

Description

technical field [0001] The present invention relates to an insulating high thermal conductivity sheet which is electrically insulating and has high heat dissipation. More specifically, it relates to an insulating highly thermally conductive sheet capable of efficiently dissipating heat from heat radiators such as electronic substrates, semiconductor chips, and light sources while ensuring insulation reliability. Background technique [0002] As electronic devices become thinner, smaller, and more powerful, the importance of heat dissipation measures has increased. As a method of dissipating heat from heat radiating bodies such as semiconductors and LEDs, metal heat radiating bodies such as aluminum and copper are usually attached. However, metals generally have electrical conductivity, and when insulation is required, an insulator is inserted between the radiator and the radiator to maintain insulation. Here, what poses a big problem is that insulators generally have low t...

AI Technical Summary

Problems solved by technology

[0004] However, this prior art has a problem that sufficient thermal conductivity cannot be obtained due to the presence of a binder resin with low thermal conductivity, voids in the filler gap, which hinders thermal conduction

However, the existing electrostatic flocking described in Non-Patent Document 5 is generally used as a production technology for raising materials such as clothes, carpets, and heat insulating materials, and does not require extreme verticality of fibers, and simultaneously contains a large amount of inclined fibers

Therefore, when using the existing electrostatic flocking technology to manufacture insulating and high thermal conductivity sheets, because the inclined fibers cannot penetrate the thickness direction of the sheet, high penetration density cannot be obtained

Images