COB (Chip On Board) light source performance testing method
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An inspection method and technology of detection method, applied in the direction of optical instrument testing, measuring devices, instruments, etc., can solve problems such as the inability to simulate the normal use of lamps and lanterns, and the inability to effectively determine whether the product meets the requirements.
Inactive Publication Date: 2014-09-10
NANJING HANDSON SCI & TECH CORP
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Summary
Abstract
Description
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Problems solved by technology
Therefore, this scheme cannot simulate the normal use state of the lamp, nor can it effectively determine whether the product meets the requirements
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0025] Step 1: Place: 8 9W COB light sources with continuous pulls in a large aluminum pan, without extrusion between products
[0026] Step 2: Use a single stripping jig to separate the above boards into individual substrates, a total of 216pcs
[0027] Step 3: Adjust the temperature of the heating platform to 150 degrees
[0028] Step 4: Use electrostatic tweezers to place the 2 products on the heating platform to ensure good contact for 10 minutes
[0029] Step: 5: Adjust the electrical parameters to 15.5V, 0.2A
[0030] Step 6: Light up the 4 products, no missing light and no light
Embodiment 2
[0032] Step 1: Place: 8 9W COB light sources with continuous pulls in a large aluminum pan, without extrusion between products
[0033] Step 2: Use a single stripping jig to separate the above boards into individual substrates, a total of 216pcs
[0034] Step 3: Adjust the temperature of the heating platform to 160 degrees
[0035] Step 4: Use electrostatic tweezers to place the 2 products on the heating platform to ensure good contact for 10 minutes
[0036] Step: 5: Adjust the electrical parameters to 15.5V, 0.2A
[0037] Step 6: Light up the 4 products, no missing light and no light
Embodiment 3
[0039] Step 1: Place: 8 9W COB light sources with continuous pulls in a large aluminum pan, without extrusion between products
[0040] Step 2: Use a single stripping jig to separate the above boards into individual substrates, a total of 216pcs
[0041] Step 3: Adjust the temperature of the heating platform to 170 degrees
[0042] Step 4: Use electrostatic tweezers to place the 2 products on the heating platform to ensure good contact for 10 minutes
[0043] Step: 5: Adjust the electrical parameters to 15.5V, 0.2A
[0044] Step 6: Light up the 4 products, 1pcs has a lack of light, and the defective rate is 0.463%
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Abstract
The invention provides a COB (Chip On Board) light source performance testing method. The COB light source performance testing method comprises the following process steps of step 1, placing COB light sources in a tray, wherein extrusion is not produced between the products; step 2, peeling the COB light sources into single pieces from a connecting plate through a single piece peeling fixture; step 3, adjusting a heating platform to the suitable temperature; step 4, placing the COB light sources in the step 2 on the heating platform after the temperature is stabilized, maintaining the contact to be good and lasting for appropriate time; step 5, opening a power supply and adjusting to corresponding electric parameters according to the different COB light source products; step 6, lighting up the COB light sources in the step 4 and observing whether a problem that the light is insufficient or out is produced or not in a macroscopic mode. According to the COB light source performance testing method, the COB light sources are placed in a certain temperature to be lightened and accordingly the use state after the light sources are assembled into a lamp is effectively simulated and the product yield detection is persuasive and professional.
Description
technical field [0001] The invention belongs to the technical field of detection methods for the yield rate of COB packaging products, in particular to a COB light source performance inspection method for judging the material matching and process stability of packaging COB packaging products. Background technique [0002] With the continuous advancement of solid-state lighting technology, COB (chip-on-board) packaging has been valued by more and more manufacturers. COB light sources have the characteristics of low thermal resistance, high luminous flux density, less glare, uniform light emission, and low cost. Can be widely used in home lighting, hotel lighting and other fields. [0003] The matching of raw materials and process stability are particularly important in the COB packaging process. Like other packaging products, COB light source chips and chips and between chips and substrates rely on gold wires (or other metal wires) to achieve electrical connections. In a COB...
Claims
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Application Information
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