A detection method for improving the resolution of area array probes

Abstract

The invention provides a detection method for improving the resolution of an area array probe, comprising the following steps: step 1, having N wafers on the ultrasonic area array probe, and the N wafers are arranged in the form of an area array; step 2, The chip controls the chip a to emit m times of pulse waves to the workpiece to be measured; step 3, the pulse waves reflected by the workpiece to be measured are respectively received by chip a and m-1 chips adjacent to chip a; step 4 , when the N wafers all emit m times of pulse waves, and the pulse waves reflected by the workpiece to be tested are all received; Step 5, repeat the process from Step 1 to Step 4 until the flaw detection is completed; Step 6, the host will The received pulse wave is analyzed and processed to obtain the defect pattern of the workpiece to be tested, which is displayed on the monitor on the host. The invention has the advantage of greatly improving the resolution of the area array detector.

Description

technical field [0001] The invention relates to the technical field of ultrasonic flaw detection, in particular to a detection method for improving the resolution of an area array probe. Background technique [0002] In the non-destructive testing of metal test pieces and parts, ultrasonic flaw detection technology is an important means. When ultrasonic waves propagate in the material to be tested, the acoustic properties of the material and changes in the internal organization have a certain impact on the propagation of ultrasonic waves. The technology of detecting material performance and structural changes through the detection of the degree and condition of ultrasonic waves is called ultrasonic testing. . Ultrasonic flaw detection is a method of detecting defective parts by using the characteristics of ultrasonic waves penetrating into the metal and passing from one section to another section, reflecting at the edge of the section. [0003] The wafer is the core part o...

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Problems solved by technology

[0003] The wafer is the core part of the ultrasonic flaw detector. The pulse wave is transmitted to the workpiece to be tested through the wafer, and the pulse wave reflected by the workpiece to be tested is processed and analyzed to obtain the defect pattern of the workpiece to be tested. In the prior art, the Take a 10mm diameter probe as an example, 52 chips are required in an 8*8 chip array, and only when the distance between chips reaches 1.25mm can the 10mm diameter range of the probe be covered, and each chip is working independently. Receive the pulse wave, which leads to the fact that the resolution of the flaw detector is less than 1.25mm when the wafer spacing is 1.25mm, and the parts cannot be accurately detected. If the resolution is increased by increasing the number of wafers, then the flaw detector will inevitably be improved. cost, and power consumption will increase

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