Unlock instant, AI-driven research and patent intelligence for your innovation.

Stereoscopic printed circuit board (PCB), and preparation method of stereoscopic printed circuit board

A three-dimensional printing and circuit board technology, applied in the field of circuits, can solve the problems of inconsistent impedance, signal integrity, and multi-piece planar PCB assembly to increase the complexity of the process, and achieve the effect of avoiding impedance differences.

Active Publication Date: 2014-09-10
LENOVO (BEIJING) CO LTD
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The assembly of multiple planar PCBs increases the complexity of the process, and at the same time, the stability of electronic equipment will also be affected
For the same signal, the impedance generated by each PCB is inconsistent. Although each PCB meets the design requirements, there will be signal integrity problems when connected together.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Stereoscopic printed circuit board (PCB), and preparation method of stereoscopic printed circuit board
  • Stereoscopic printed circuit board (PCB), and preparation method of stereoscopic printed circuit board
  • Stereoscopic printed circuit board (PCB), and preparation method of stereoscopic printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0041] figure 1 It is a structural schematic diagram of a three-dimensional printed circuit board provided in an embodiment of the present invention, see figure 1 , the three-dimensional printed circuit board includes:

[0042] At least one circuit layer 101;

[0043] at least one insulating layer 102;

[0044] Wherein, when the number of circuit layers is greater than 1, the two adjacent circuit layers 101 are separated by the insulating layer 102, and the adjacent circuit layers 101 and the insulating layer 102 are bonded; wherein, the at least An insulating layer 102 includes a first type insulating layer, the first type insulating layer at least includes a first part and a second part, the first part of the first type insulating...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a stereoscopic printed circuit board (PCB), and a preparation method of a PCB, and belongs to the field of a circuit. The stereoscopic PCB comprises at least one circuit layer and at least one insulation layer, wherein the number of circuit layers is greater than one, neighboring two circuit layers are separated by the insulation layer, and the neighboring circuit layers are attached to the insulation layer; and the at least one insulation layer comprises a first-type insulation layer, the first-type insulation layer at least comprises a first portion and a second portion, the first portion of the first-type insulation layer is disposed at a first plane, the second portion of the first-type insulation layer is disposed at a second plane, and the first plane is different from the second plane. By using the technical scheme provided by the invention, the stereoscopic PCB can be suitable for the demands of electronic devices in different shapes, multiple planar PCBs are replaced by use of one stereoscopic PCB, and the impedance difference caused by use of the multiple planar PCBs is avoided.

Description

technical field [0001] The invention relates to the field of circuits, in particular to a three-dimensional printed circuit board and a preparation method of the three-dimensional printed circuit board. Background technique [0002] PCB (Printed Circuit Board, printed circuit board) is an important electronic component and a support for electronic components. Almost every kind of electronic equipment, from small electronic watches and calculators to large computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed circuit boards will be used. After electronic equipment adopts printed circuit boards, due to the consistency of similar printed circuit boards, manual wiring errors are avoided, and automatic insertion or placement of electronic components, automatic soldering, and automatic detection can be realized, ensuring the quality of electronic equipment. Improve labor producti...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/00H05K3/00
Inventor 余秀青
Owner LENOVO (BEIJING) CO LTD