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Semiconductor packages and methods of packaging semiconductor devices

A technology for semiconductors and packaging substrates, which is applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, and semiconductor/solid-state device components, etc. It can solve the problems of limited reliability of packaging level and difficult process.

Active Publication Date: 2014-09-17
UTAC HEADQUARTERS PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While leadframe-based packages such as HLA provide an economical alternative, the process used to produce HLA packages is not easy and has limited reliability at the package level

Method used

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  • Semiconductor packages and methods of packaging semiconductor devices
  • Semiconductor packages and methods of packaging semiconductor devices
  • Semiconductor packages and methods of packaging semiconductor devices

Examples

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Embodiment Construction

[0012] Embodiments relate to semiconductor packages and methods for forming semiconductor packages. The package is used to package one or more semiconductor die or chips. In the case of more than one die, the die may be arranged in a planar arrangement, a vertical arrangement, or a combination thereof. Dies may include, for example, memory devices, logic devices (eg, mixed-signal logic devices), communication devices, RF devices, optoelectronic devices, digital signal processors (DSPs), microcontrollers, system-on-chips (SOCs) and other types of devices or combinations thereof. The package can be incorporated into electronic products or devices, such as phones, computers, and mobile and mobile smart products. Incorporation of packages into other types of products is also applicable.

[0013] Figure 1-3 Simplified cross-sectional views illustrating different embodiments of semiconductor packages. Such as figure 1 As shown in , a semiconductor package 100 includes a packa...

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PUM

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Abstract

Semiconductor packages and methods for forming a semiconductor package are presented. The method includes providing a package substrate having first and second major surfaces. The package substrate includes at least one substrate layer having at least one cavity. Interconnect structure is formed. At least one conductive stud is formed within the cavity and a conductive trace and a connection pad are formed over the first major surface of the package substrate and are coupled to top surface of the conductive stud. A package pad is formed and is directly coupled to the conductive stud. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structure. A cap is formed over the package substrate to encapsulate the die.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to the technical field of semiconductor packaging. Background technique [0002] Ball grid array (BGA) packages, thermal leadless array (TLA) packages, and leadframe-based packages, such as high-density leadframe array (HLA) packages, are common packaging methods for high I / O devices in the industry. However, existing BGA, TLA and lead frame based packages have several disadvantages. For example, BGAs can provide high pin counts, however, the cost of producing BGAs is relatively high and the thermal performance of BGA packages needs to be improved. On the other hand, there is a need to increase the robustness and reliability of the TLA package in terms of, for example, lead pull strength and die pad drop. While lead frame based packages such as HLA provide an economical alternative, the process used to produce HLA packages is not easy and has limited reliability at the package level....

Claims

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Application Information

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IPC IPC(8): H01L21/768H01L23/538
CPCH01L2924/15311H01L24/27H01L24/33H01L2924/18161H01L23/49861H01L21/486H01L23/49816H01L21/4846H01L24/48H01L24/16H01L21/76885H01L23/3128H01L2224/81191H01L23/49827H01L21/4853H01L23/49838H01L23/5385H01L23/147H01L2224/32225H01L2224/16225H01L2224/73265H01L2224/48228H01L2224/48227H01L2224/48091H01L2924/19105H01L2924/00014H01L2924/00H01L2224/16238H01L2224/2919H01L2924/15747H01L2924/181H01L2924/0665H01L2224/13099H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207H01L23/49811H01L23/49866H01L24/32H01L2924/01028H01L23/3142H01L21/6835H01L2224/03614H01L2224/03436H01L2224/03464H01L2224/03622H01L24/83H01L2224/02319H01L2224/11436H01L24/85H01L2224/04042
Inventor 杨永波小安东尼·班巴拉·迪曼诺胡振鸿
Owner UTAC HEADQUARTERS PTE LTD
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