Display device and binding method thereof
A display device and bonding technology, applied in the manufacture of semiconductor devices, electrical solid devices, semiconductor/solid devices, etc., can solve the pollution of ALD deposition layer, there is no way to process ALD deposition layer with photolithography technology, and the bonding area cannot be touched, etc. question
Active Publication Date: 2014-09-17
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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Problems solved by technology
Before the traditional OLED is packaged by ALD, it is usually necessary to mask the bonding area of the OLED to be bonded (IC) and the circuit board. However, due to the extremely high wrapping and step coverage of the ALD technology, after ALD After that, the above-mentioned masked bonding area may still be polluted by the ALD deposition layer, thus causing the bonding area to fail to make normal contact with the chip (IC) or circuit board
In addition, due to the high sensitivity of OLED to water, there is no way to use photolithography to process the ALD deposition layer in the above-mentioned bonding region.
Method used
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Embodiment Construction
[0024] Please refer figure 1 This embodiment discloses an OLED 100, which mainly includes a substrate 110. The substrate 110 is provided with a light-emitting area 111, a lead area 112 and a bonding area 113. The light-emitting area 111 is located in the center of the substrate 110 and is used for OLED image display. It is sequentially provided with an anode layer, an organic functional layer and a cathode layer. The lead area 112 is the wiring area of the anode lead and the cathode lead. The anode lead and the cathode lead in the lead area 112 are bonded to a chip (IC) or a circuit board or other bonding components through the bonding area 113. It should be pointed out that the OLED of this embodiment is a unilateral bonding type, that is, all cathode leads and all anode leads are concentrated on one side to be bonded to the driver chip or circuit board. In other embodiments, the OLED can be a bilateral bonding type (i.e. All cathode leads are concentrated on one side for b...
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Abstract
The invention discloses a binding method of a display device and the display device manufactured according to the binding method. The display device comprises a substrate and a binding piece arranged on the substrate. A binding area corresponding to the binding piece is arranged on the substrate. The binding method of the display device includes the steps of covering the binding area of the substrate with a piece of anisotropic conducting film, conducting atomic layer deposition to form an atomic layer deposition layer, puncturing the position covered with the anisotropic conducting film, and binding the binding piece to the anisotropic conducting film. According to the binding method of the display device, the substrate is packaged according to the atomic layer deposition technology, the binding process of the binding piece is set behind deposition of the anisotropic conducting film, and the substrate and the binding piece are bound by puncturing the position covered with the anisotropic conducting film. By means of the binding method, the display device can be effectively bound without conducting graphical processing on the atomic layer deposition layer, the binding process of the display device is simplified, and production cost is reduced.
Description
Technical field [0001] The present invention relates to the field of display technology, in particular to a bonding method of a display device and a display device manufactured by using the method. Background technique [0002] Atomic Layer Deposition (ALD: Atomic Layer Deposition) technology has extremely high encapsulation and step coverage. It is a new type of encapsulation technology used in the OLED field. The OLED encapsulated by ALD has extremely high water resistance and corrosion resistance. Sex. Before traditional OLED is packaged by ALD, it is usually necessary to mask the bonding area of the IC and circuit board on the OLED. However, due to the extremely high encapsulation and step coverage of ALD technology, Later, the above-mentioned masked bonding area may still be contaminated by the ALD deposition layer, resulting in the bonding area being unable to normally contact the chip (IC) or the circuit board. In addition, due to the high sensitivity of OLED to water,...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L51/56H01L27/32H01L51/52
CPCH01L24/81H01L21/4846H01L2224/81009H10K50/84
Inventor 林立刘雪洲柳冬冬刘胜芳平山秀雄
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD