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Display device and its bonding method

A display device and bonding technology, which is applied in semiconductor devices, electrical solid devices, semiconductor/solid device manufacturing, etc., can solve the pollution of ALD deposition layer, there is no way to process ALD deposition layer with photolithography technology, and the bonding area cannot be touched, etc. question

Active Publication Date: 2016-04-13
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Before the traditional OLED is packaged by ALD, it is usually necessary to mask the bonding area of ​​the OLED to be bonded (IC) and the circuit board. However, due to the extremely high wrapping and step coverage of the ALD technology, after ALD After that, the above-mentioned masked bonding area may still be polluted by the ALD deposition layer, thus causing the bonding area to fail to make normal contact with the chip (IC) or circuit board
In addition, due to the high sensitivity of OLED to water, there is no way to use photolithography to process the ALD deposition layer in the above-mentioned bonding region.

Method used

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  • Display device and its bonding method
  • Display device and its bonding method
  • Display device and its bonding method

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Embodiment Construction

[0024] Please refer to figure 1 , this embodiment discloses an OLED 100 which mainly includes a substrate 110 . The substrate 110 is provided with a light emitting area 111 , a lead area 112 and a bonding area 113 . The light emitting region 111 is located at the center of the substrate 110 and is used for image display of the OLED, which is provided with an anode layer, an organic functional layer and a cathode layer in sequence. The lead area 112 is the wiring area for the anode lead and the cathode lead, and the anode lead and the cathode lead in the lead area 112 are bonded to chips (IC) or circuit boards and other bonding components through the bonding area 113 . It should be pointed out that the OLED in this embodiment is a single-sided bonding type, that is, all cathode leads and all anode leads are concentrated on one side and bonded to a driver chip or a circuit board. In other embodiments, the OLED can be a double-sided bonding type (about All the cathode leads are...

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Abstract

The present invention reveals a statement method of a display device and a display device made of the above -mentioned state -oriented method.The display devices include the substrate and the states set on the substrate. The substrate is equipped with a state -oriented area corresponding to the state.The state setting method of the displaying device includes: in the substrate state -state -stricken area covers the opposite sex conductive membrane; the atomic layer is deposited and the atomic layer deposition layer;Settle until the opposite sex conductive membrane.The above -mentioned display device state -determination method is used to encapsulate the substrate with the atomic layer sedimentation technology, and the state -defined processes of the state fixation are set in the heterosexual conductive film deposition, andThen realize the states between the substrate and the states.This state -based method does not need to perform graphical treatment of the atomic layer sedimentation layer.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a bonding method of a display device and a display device manufactured by using the method. Background technique [0002] Atomic Layer Deposition (ALD: Atomic Layer Deposition) technology has extremely high wrapping and step coverage, and is a new packaging technology used in the field of OLEDs. OLEDs packaged by ALD have extremely high water resistance and corrosion resistance. Before the traditional OLED is packaged by ALD, it is usually necessary to mask the bonding area of ​​the OLED to be bonded (IC) and the circuit board. However, due to the extremely high wrapping and step coverage of the ALD technology, after ALD Finally, the masked bonding area may still be polluted by the ALD deposition layer, resulting in the bonding area not being in normal contact with the chip (IC) or circuit board. In addition, due to the high sensitivity of OLED to water, there is no way to use ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56H01L27/32H01L51/52
CPCH01L24/81H01L21/4846H01L2224/81009H10K50/84
Inventor 林立刘雪洲柳冬冬刘胜芳平山秀雄
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD