7results about How to "Simplify the bonding process" patented technology

The invention provides a chip bonding device and method. The chip bonding device comprises a bonding head used for adsorbing a chip to be bonded and adjusting the pose of the chip; the infrared vision system is used for penetrating through the chip so as to acquire images of the first mark on the back surface of the chip and the second mark at the target bonding position of the chip; and a controller configured to: acquire, via the infrared vision system, an image with the first marker and the second marker; analyzing the image to determine the poses of the first mark and the second mark in the image; adjusting the pose of the bonding head according to the pose difference of the first mark and the second mark in the image, so that the chip is aligned with the target bonding position; and bonding the chip to the target bonding position through the bonding head. According to the invention, extra errors caused by using a calibration sheet as an intermediate medium in the bonding process can be avoided, the bonding precision is improved, and the bonding process is simplified, so that the bonding efficiency is improved, and the productivity of equipment is improved.

The invention discloses a preparation method of a biomass adhesive for bonding wood at room temperature without pressure and a bonding method of the biomass adhesive, and belongs to the field of wood processing. The problems that an existing biomass adhesive is large in viscosity, low in bonding strength, poor in water resistance and complex in process are solved. The method comprises the following steps: 1, treating the surface of a veneer to remove part of lignin and hemicellulose; secondly, the pretreated veneer is soaked in a cellulose solvent system to be completely dissolved; the bonding method comprises the following steps: coating the biomass adhesive for bonding the wood at room temperature without pressure on a to-be-bonded surface of the wood, then butting, dipping in water at room temperature, and finally drying at room temperature, thereby completing the bonding method. The preparation method is used for preparing and bonding the biomass adhesive for bonding the wood at room temperature without pressure.

The invention discloses a micro fingertip multi-dimensional force sensor based on a Hall effect, and particularly relates to the technical field of industrial automation, and the micro fingertip multi-dimensional force sensor comprises a magnetic body, a deformable flexible fingertip, a Hall sensor group and a base. The magnetic body and the Hall sensor group are embedded into the flexible fingertip and are fixed on the base; wherein the Hall sensor group comprises a Hall sensor 3a, a Hall sensor 3b and a Hall sensor 3c; when the flexible fingertips are stressed to generate elastic deformation, the magnetic bodies embedded in the flexible fingertips can generate displacement relative to the Hall sensor group to realize cooperative deformation; when a magnetic induction line penetrates through the Hall sensor group, the Hall sensor 3a, the Hall sensor 3b and the Hall sensor 3c respectively output proportional voltage signals according to the magnetic field intensity, and then sensing of external multi-dimensional force is achieved.

The application discloses a wafer surface activation bonding device and a bonding method, and relates to the technical field of wafer processing. The device comprises a clamp, a movable support rod and a bombardment particle emission device. The clamp comprises oppositely arranged first and second sample holders, and the first and second sample holders are each provided with a hard nonmetal back plate. Two wafers to be bonded are fixed on the hard nonmetal back plate, and the surface area of the two wafers to be bonded that is in contact with each other is a bonding area, which is surrounded by the surface of the hard nonmetal back plate. The movable support rod is arranged at least on the outer side of any one of the first and second sample holders, so that relative extrusion between the first and second sample holders is realized, and the bonding area of the surfaces of the two wafers to be bonded is fully contacted under the action of pressure. The bombardment particle beam spot emitted by the bombardment particle emission device uniformly covers the bonding area of the two wafers to be bonded. The application can effectively avoid the introduction of metal contamination at the bonding interface, and has the advantages of simple process, good compatibility and the like.

This invention discloses a pre-packaged chip module and its bonding structure. The pre-packaged chip module includes a semiconductor chip and a hot melt adhesive encapsulator. The bottom surface of the semiconductor chip includes a plurality of protruding electrodes. The hot melt adhesive encapsulator covers all sides of the semiconductor chip. The electrodes of the semiconductor chip are exposed in a window at the lower end of the hot melt adhesive encapsulator, and the bottom surface of the semiconductor chip electrodes is flush with or protrudes from the bottom surface of the hot melt adhesive encapsulator. The bonding structure includes a circuit board. The pre-packaged chip module is arranged on top of the circuit board, and the chip pads corresponding to the semiconductor chip electrodes of the pre-packaged chip module are aligned. The bottom surface of the hot melt adhesive encapsulator of the pre-packaged chip module is bonded to the substrate and circuit layer of the circuit board, and the electrodes of the semiconductor chip in the pre-packaged chip module form a conductive electrical connection with the corresponding chip pads. This pre-packaged chip module simplifies the chip bonding process, increases chip bonding production efficiency, and reduces the total cost of the product.

This invention relates to a bonding paste for crystals, a bonding method, and applications of the bonding method. The bonding paste is formed from the following powders in a specified percentage ratio: SiO₂ 2 20-60%, Al 2 O 3 :30‑45%, MgO: 0‑8%, CaF 2 0-3%, Na 2 O: 0-10%, K 2 O: 0-10%, B 2 O 3 The bonding method includes steps such as synthesizing a bonding slurry for the crystals, applying pressure and bonding, and high-temperature treatment. This invention, by adjusting the proportions of the slurry components and the temperature regime, forms a micrometer-scale glass transition interface between crystals. Compared to high-temperature bonding processes, this invention can achieve bonding between crystal atoms at temperatures far below the crystal's melting point, with strong bonding forces, a smooth and transparent interface, and no cloudiness at the interface. This method greatly simplifies the traditional high-temperature, high-pressure bonding process and significantly improves the yield.

The utility model discloses an apex laminating disc capable of adapting to multiple specifications. The apex laminating disc comprises an ejector rod assembly, a plurality of laminating discs, a plurality of guide rails, a plurality of first connecting plates, a clamping assembly, a mounting plate, a swinging driver, a plurality of second connecting plates and a nylon sleeve, the nylon sleeve is arranged at the top of the swinging driver, the attaching disc is detachably connected with the second connecting plate, the guide rail is detachably connected with the upper surface of the mounting plate, the second connecting plate slides in the radial direction of the guide rail, the swinging driver is fixedly connected with the upper surface of the mounting plate, and the clamping assembly is arranged on the outer side of the attaching disc. The ejector rod assembly is arranged above the laminating disc; the bead ring and apex laminating device is simple in structure and convenient to operate, multi-specification adjustment of the laminating disc is easily completed, rapid and accurate expansion and contraction of the laminating disc are achieved, the laminating process of a bead ring and apex is simplified, the bead forming efficiency is improved, the bead forming quality is guaranteed, and full automation of the bead ring and apex laminating process is achieved.