134results about How to "Simplify the bonding process" patented technology

The invention provides a hot melt adhesive membrane for bonding a bi-metallic composite plate and a preparation method of the hot melt adhesive membrane. The adhesive membrane is prepared by the following steps: adopting one or several from polyacrylate rubber, polyethylene-acrylic acid (ester) copolymer or polyvinyl chloride-vinyl acetate esters copolymer as adhesive-based resin; adopting one or several blends from polyethylene, chloridize polyethylene, polyethylene-octene copolymer, ethylene propylene rubber, polyethylene-vinyl acetate, polymethyl methacrylate, polymethyl methacrylate-butadiene-styrene copolymer, polystyrene, thermoplastic polyurethane and polyvinyl chloride as a second matrix; adding a certain amount of thickening agents, fillers and functional additives after pre-mixing; and then casting to form the membrane. The hot melt adhesive membrane has high bonding strength and lasting stability, excellent weather resistance, aging resistance of salt mist, and water resistance, and is suitable for compounding and bonding of metal materials such as stainless steel, galvanized steel, iron, aluminum, copper, titanium alloys and the like.

The invention discloses a high-temperature-resistant hot melt adhesive membrane for aluminum honeycomb boards, and a preparation method thereof. The high-temperature-resistant hot melt adhesive membrane for aluminum honeycomb boards is made from, by weight percent, 30-50% of polyester elastomer with above 180 DEG C of melting point, 10-40% of polyolefin copolymer modified by maleic anhydride, 0-40% of polyolefin copolymer, 10-30% of tackifying resin, 0-15% of filler, and 1-3% of functional aid. The components add up to 100%. The high-temperature-resistant hot melt adhesive membrane for aluminum honeycomb boards has the advantages of high adhesion strength, instantaneous resistance to the temperature up to 170-190 DEG C, and long-term resistance to the temperature up to 130 DEG C.

The invention provides a TPU (thermoplastic polyurethane) hot melt adhesive membrane. The TPU hot melt adhesive membrane is mainly prepared from the following raw materials in parts by weight: 100 parts of TPU, 30-50 parts of thermoplastic polyester of which the melting point is 90-105 DEG C, 10-30 parts of a tackifier, 5-25 parts of a filling material and 5-30 parts of a functional auxiliary agent. The hot melt adhesive membrane prepared by using the method provided by the invention is of a thermoplastic adhesive, is uniform in thickness and simple in bonding process, is suitable for bonding by adopting an automatic production line, is high in production efficiency and large in peeling strength after bonding, can resist water, heat and salt fog aging in an outdoor harsh environment, is durable in bonding, and can be used for significantly improving the bonding strength of the hot melt adhesive membrane adhered to fabrics.

The invention discloses a microfluidic surface-enhanced Raman scattering detector and its preparation method and use. The microfluidic surface-enhanced Raman scattering detector comprises an active base and a microfluidic channel-containing structure layer. A microfluidic channel chamber is formed between the active base and the microfluidic channel-containing structure layer. The active base corresponding to the microfluidic channel chamber is provided with multiple nanoscale concave structures. The microfluidic channel-containing structure layer corresponding to the microfluidic channel chamber is provided with at least one pair of a liquid inlet and a liquid outlet communicated with the microfluidic channel chamber. A metal layer is coated on nanoscale concave structure surfaces and an active base surface located in the microfluidic channel chamber. The microfluidic surface-enhanced Raman scattering detector having a double-layer polydimethylsiloxane structure has a high yield, a low cost, good detection consistency and no noise interference and can realize real-time monitoring. The microfluidic surface-enhanced Raman scattering detector can be used for detection of an analyte in gas, colloid and liquid environments.

The invention relates to a styrene modified polyvinyl acetate emulsion and a preparation method, and relates to the modified polyvinyl acetate emulsion and the preparation method. The styrene modified polyvinyl acetate emulsion comprises the following raw materials by weight: 58-62% of deionized water, 2-10% of polyving akohol, 20-35% of mixed monomer 1, 4-20% of mixed monomer 2, 0.6-2% of compound emulsifier, 0.1-0.5% of pH buffering agent and 0.1-1% of initiator. The preparation method employs a staging polymerization mode, in a first stage, vinyl acetate monomer is polymerized to form a polymer seed; in a second stage, a styrene monomer is polymerized in the polymer seed to form emulsion particles with a two-phase separation structure. According to the invention, the process is simple, the cost is low, the boiling water resistance performance of the polyvinyl acetate emulsion is increased, no environmental pollution is generated, and cold pressure curing at normal temperature, and the styrene modified polyvinyl acetate emulsion can be directly used as aqueous adhesives.

The invention relates to a vulcanization bonding process by a template method for conveying belts, which comprises: cutting a cloth layer and a glue layer of a belt joint part into symmetric gradient according to a certain form and angle, smearing rubber cement for bonding, then heating for a certain time to perform a vulcanization reaction at a certain pressure and temperature so as to allow rawrubber to become vulcanized rubber and provide the joint with optimal bonding strength. The invention introduces a bold innovation based on the original thermal bonding process, establishes a new process of lineation cutting and peeling for vulcanization bonding template; the process greatly shortens the bonding time; the new cutting and bonding process for the vulcanization bonding template method is safe, simple and rapid, saves human and material resources, improves working efficiency, increases the quality by 15-20%, and fills a gap in belt vulcanization bonding technology.

The invention provides a micro electro mechanical system (MEMS) microphone and an encapsulation method thereof. The MEMS microphone comprises a circuit board and a shell fixedly connected with the circuit board; the circuit board is combined with the opening end of the shell to form an encapsulation structure of the MEMS microphone; moreover, an annular insulation adhesive layer is arranged between the circuit board and the opening end of the shell; and the three parts, namely the surface of the opening end of the shell, the annular insulation adhesive layer, and the position, combined with the opening end of the shell, of the circuit board form a capacitor. In the MEMS microphone, the insulation adhesive layer instead of a conductive adhesive which has high boundedness, high cost and poor adhering effect is adopted between the shell and the circuit board; and by the technical scheme, the adhering process is simple, the production cost is reduced, and the large-scale popularization of the MEMS microphone is facilitated.

The invention discloses a process for adhering electronic paper and a touch screen. The process comprises the steps of (1) adhering: adhering and fixing an electronic paper body and the touch screen by using a COF adhesive; (2) vacuum heating and adhering: heating and adhering the adhered product in step (1) under the vacuum environment; (3) ultraviolent curing: performing ultraviolent curing on the vacuum heated product. According to the process for adhering the electronic paper and the touch screen, the COF adhesive is taken as the adhesive, so that the clarity and the highlight degree are high, the adhesive power is high, and the water resistance and high-temperature resistance are excellent; the weather resistance is excellent, and the adhered product is not yellowed after being used for a long term; the electronic products are adhered by the COF adhesive, so that the problems that the water resistance of an adhered product is not up to standard after glue is squeezed out, and the electronic paper adhered by an OCA adhesive generates white points can be completely solved; furthermore, the adhesive membrane can be removed any time; the yield is high, and the adhering process is simple; the process is not only suitable for adhering the electronic paper and the touch screen, but also suitable for adhering the electronic paper and other electronic elements.

The invention discloses a hot melt adhesive. The hot melt adhesive consists of the following materials in parts by weight: 89-92 parts of polyamide resin, 3-7 parts of paraffin, 3-7 parts of rosin ester-rosin glycerol resin, less than 0.5 part of organic silicon and less than 0.5 part of nitrate. The hot melt adhesive has the following advantages that firstly, the curing speed is quick, and the bonding strength and the flexibility are better; the hot melt adhesive can be used for curing and bonding within a fraction of second to a few seconds, and has the characteristics of being molten while being heated up and being bonded while being cooled, so that a packer using the hot melt adhesive can adopt a production line with higher speed, the yield can be increased while the defective goods are reduced, the continuous and automatic high-speed operation is convenient, and the cost is lower; secondly, the bonding power of the hot melt adhesive is very stable and not affected by morning-evening temperature and humidity changes in a working environment, so that the bonding firmness is ensured, and a bonding exposure problem of a packing machine is eliminated; and thirdly, the hot melt adhesive does not contain water and any other solvent. Besides, the hot melt adhesive is easy to transport and store, long in service life, capable of eliminating damages and waste, and convenient to use.

The invention discloses a single-slot self-lubricating oscillating bearing with an outer ring provided with composite lining plates and a manufacturing method thereof. The single-slot self-lubricating oscillating bearing has the advantages of simple structure, low cost, good self-lubricating effect and strong bearing capacity and adopts the structure that at least four steel backing composite lining plates distributed radially along the circumference are adhered on the inner surface of the outer ring. The manufacture method comprises the steps of: processing the outer ring and an inner ring by using bearing steel, wherein the outer ring is provided with an axial seam; manufacturing the at least four steel backing composite lining plates coincident with the inner surface of the outer ring in shape after being spliced radially; hacking the surface of the steel backing of each steel backing composite lining plate, grooving the surface of the steel backing and carrying out running-in on a radial splicing surface; sequentially and radially splicing the steel backing composite lining plates tightly along the circumference direction by taking the axial seam of the outer ring as an initial point and adhering on the inner surface of the outer ring, heating and solidifying an adhering agent under the condition of applying external force on an adhering surface; and directly loading the inner ring into the outer ring.

The invention discloses an environment-friendly type EPDM (ethylene propylene diene monomer) adhesive for increasing adhesion force between EPDM rubber and curtain lines. The environment-friendly typeEPDM adhesive is mainly prepared from an EPDM mixing glue and a hydrocarbon solvent oil according to a weight ratio of 1 to (2 to 8), wherein the EPDM mixing glue is mixed by the EPDM rubber, a vulcanizer, a crosslinking additive, an adhesive, zinc oxide, stearic acid, carbon black, white carbon black and maleic anhydride-grafted polymer. The environment-friendly type EPDM adhesive has the advantages that the adhesion force between the EPDM rubber and the polyester fiber, vinylon curtain lines as well as manmade yarns is effectively increased; the environment-friendly effect is realized, theproduction of toxic or harmful matters is avoided in the preparation and use process, and the injury to human bodies and environments is extremely low.

The invention discloses an ultrasonic welding device for hygienic product compositing. The device comprises a supporting frame, an ultrasonic assembly, an anvil roller and a distance adjusting mechanism. A movable plate is arranged in the middle of the supporting frame. The ultrasonic assembly is arranged on the movable plate. The two sides of the movable plate are connected with the supporting frame through the distance adjusting mechanism. The distance adjusting mechanism drives the movable plate and the ultrasonic assembly to move up and down along the supporting frame. The anvil roller is arranged below the ultrasonic assembly and connected with the supporting frame through a rotating shaft. According to the ultrasonic welding device, by means of the welding function of an ultrasonic device, two layers of materials are welded and bonded, a traditional hot melting adhesive bonding technology is replaced, consumption of hot melting adhesive raw materials is replaced, the production cost is lowered, meanwhile, the bonding technology is simplified, and the production efficiency is improved. The distance between the ultrasonic assembly and the anvil roller is adjusted through the distance adjusting mechanism, the parallelism between the ultrasonic assembly and the anvil roller is adjusted through a precision adjusting mechanism, and composite material bonding accuracy can be effectively ensured.

The invention discloses a thermal insulation board for an outer wall, which comprises a thermal insulation layer and an interface layer, and the thermal insulation layer adopts inorganic fiber cotton. The important feature of the present invention is that the fiber orientation of the inorganic fiber cotton is perpendicular to the interface layer and the wall surface. This makes the drawing direction of the inorganic fiber cotton parallel to the direction of the wind and the direction of the force after installation, which improves the tensile and compressive strength and resists the damage to the wall caused by the wind pressure.

The invention provides a method for reducing current on bonded leads of power supply pads of a chip. The chip is provided with a plurality of power supply pads and a plurality of virtual pads which are arranged at four corners of the chip and used for relieving chip stress; and the power supply pads and the virtual pads are all connected with a power bus and are electrically connected with a lead frame through the bonded leads. The method reduces the current on each bonded lead so as to reduce inductance on each bonded lead and noise caused by the inductance; and the whole bonding process is easy to implement, and an extra area of the chip is not occupied.