4results about How to "Simplify the bonding process" patented technology

The application discloses a wafer surface activation bonding device and a bonding method, and relates to the technical field of wafer processing. The device comprises a clamp, a movable support rod and a bombardment particle emission device. The clamp comprises oppositely arranged first and second sample holders, and the first and second sample holders are each provided with a hard nonmetal back plate. Two wafers to be bonded are fixed on the hard nonmetal back plate, and the surface area of the two wafers to be bonded that is in contact with each other is a bonding area, which is surrounded by the surface of the hard nonmetal back plate. The movable support rod is arranged at least on the outer side of any one of the first and second sample holders, so that relative extrusion between the first and second sample holders is realized, and the bonding area of the surfaces of the two wafers to be bonded is fully contacted under the action of pressure. The bombardment particle beam spot emitted by the bombardment particle emission device uniformly covers the bonding area of the two wafers to be bonded. The application can effectively avoid the introduction of metal contamination at the bonding interface, and has the advantages of simple process, good compatibility and the like.

This invention discloses a pre-packaged chip module and its bonding structure. The pre-packaged chip module includes a semiconductor chip and a hot melt adhesive encapsulator. The bottom surface of the semiconductor chip includes a plurality of protruding electrodes. The hot melt adhesive encapsulator covers all sides of the semiconductor chip. The electrodes of the semiconductor chip are exposed in a window at the lower end of the hot melt adhesive encapsulator, and the bottom surface of the semiconductor chip electrodes is flush with or protrudes from the bottom surface of the hot melt adhesive encapsulator. The bonding structure includes a circuit board. The pre-packaged chip module is arranged on top of the circuit board, and the chip pads corresponding to the semiconductor chip electrodes of the pre-packaged chip module are aligned. The bottom surface of the hot melt adhesive encapsulator of the pre-packaged chip module is bonded to the substrate and circuit layer of the circuit board, and the electrodes of the semiconductor chip in the pre-packaged chip module form a conductive electrical connection with the corresponding chip pads. This pre-packaged chip module simplifies the chip bonding process, increases chip bonding production efficiency, and reduces the total cost of the product.

This invention relates to a bonding paste for crystals, a bonding method, and applications of the bonding method. The bonding paste is formed from the following powders in a specified percentage ratio: SiO₂ 2 20-60%, Al 2 O 3 :30‑45%, MgO: 0‑8%, CaF 2 0-3%, Na 2 O: 0-10%, K 2 O: 0-10%, B 2 O 3 The bonding method includes steps such as synthesizing a bonding slurry for the crystals, applying pressure and bonding, and high-temperature treatment. This invention, by adjusting the proportions of the slurry components and the temperature regime, forms a micrometer-scale glass transition interface between crystals. Compared to high-temperature bonding processes, this invention can achieve bonding between crystal atoms at temperatures far below the crystal's melting point, with strong bonding forces, a smooth and transparent interface, and no cloudiness at the interface. This method greatly simplifies the traditional high-temperature, high-pressure bonding process and significantly improves the yield.

The utility model discloses an apex laminating disc capable of adapting to multiple specifications. The apex laminating disc comprises an ejector rod assembly, a plurality of laminating discs, a plurality of guide rails, a plurality of first connecting plates, a clamping assembly, a mounting plate, a swinging driver, a plurality of second connecting plates and a nylon sleeve, the nylon sleeve is arranged at the top of the swinging driver, the attaching disc is detachably connected with the second connecting plate, the guide rail is detachably connected with the upper surface of the mounting plate, the second connecting plate slides in the radial direction of the guide rail, the swinging driver is fixedly connected with the upper surface of the mounting plate, and the clamping assembly is arranged on the outer side of the attaching disc. The ejector rod assembly is arranged above the laminating disc; the bead ring and apex laminating device is simple in structure and convenient to operate, multi-specification adjustment of the laminating disc is easily completed, rapid and accurate expansion and contraction of the laminating disc are achieved, the laminating process of a bead ring and apex is simplified, the bead forming efficiency is improved, the bead forming quality is guaranteed, and full automation of the bead ring and apex laminating process is achieved.