Soldering assisting glue and preparing method and application thereof

A technology of additives and rosin, applied in welding equipment, welding media, manufacturing tools, etc., can solve problems such as easy displacement and falling off, low bonding strength, etc., achieve reliable welding, simple bonding process, and simplify subsequent welding processes Effect

Active Publication Date: 2018-11-06
上海华庆焊材技术股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary soldering flux or soldering paste has a certain degree of viscosity, but its bonding strength is too small, and it is easy to shift and fall off during transportation, movement or vibration, which cannot meet the application requirements

Method used

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  • Soldering assisting glue and preparing method and application thereof
  • Soldering assisting glue and preparing method and application thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0072] The second aspect of the present invention provides the preparation method of the solder flux paste, at least including the following steps:

[0073] Add rosin and tackifier into the container in parts by weight, heat to 160-170°C, stir until completely melted and mix evenly, then add thixotropic agent, continue stirring for 5-10min, then cool down, at 100-150°C The activators are added in descending order of solubility, the stirring is stopped after stirring evenly, the diluent is added after cooling to 30-50° C., the solvent is fully stirred and then cooled to room temperature to obtain the solder flux paste.

[0074] The solubility refers to the solubility of the tackifier in the active agent at normal temperature and pressure.

[0075] The solubility of rosin in the activator is better than that of the tackifier, so the inappropriate order of adding the activator may affect the stability of the rosin and tackifier system, thereby affecting the bonding performance of...

Embodiment 1

[0085] Embodiment 1 provides a soldering flux adhesive, which at least includes the following components in parts by weight: 20 parts of rosin, 2 parts of active agent, 5 parts of tackifier, 3 parts of thixotropic agent, and 5 parts of diluent.

[0086] Described rosin is water white rosin. The active agent is a mixture of adipic acid and rosinamine with a mass ratio of 1:1. The tackifier is polyisobutylene with a molecular weight of 6000. The thixotropic agent is dehydrated castor oil fatty acid. Described diluent is xylene.

[0087] The preparation method of described welding flux paste at least comprises the following steps:

[0088] Add rosin and tackifier into the container in parts by weight, heat to 160-170°C, stir until completely melted and mix evenly, then add thixotropic agent, continue stirring for 5-10min, then cool down, at 100-150°C The activators are added in descending order of solubility, the stirring is stopped after stirring evenly, the diluent is added...

Embodiment 2

[0090] Example 2 provides a soldering flux, which at least includes the following components in parts by weight: 40 parts of rosin, 2 parts of active agent, 10 parts of tackifier, 20 parts of thixotropic agent, and 5 parts of thinner.

[0091] Described rosin is maleic rosin. The active agent is selected from a mixture of succinic acid, succinamide and 2-butylimidazole, and the mass ratio thereof is 1:1:2. The tackifier is polybutene with a molecular weight of 6000. Described thixotropic agent is ricinoleic acid. Described diluent is methyl acetate.

[0092] The preparation method of the solder flux paste is the same as in Example 1.

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Abstract

The invention relates to the technical field of welding, in particular to soldering assisting glue and a preparing method and application thereof. The soldering assisting glue at least comprises the following components including, by weight, 20-60 parts of rosin, 2-15 parts of an active agent, 5-30 parts of a tackifier, 0-20 parts of a thixotropic agent and 5-60 parts of a diluent.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to a welding flux glue and its preparation method and application. Background technique [0002] Solder preform is a kind of precision-shaped solder that can be made into different shapes, sizes and surface shapes according to requirements. It is suitable for various product manufacturing processes with small tolerances. It is widely used in printed circuit board (PCB) assembly, connectors And terminal equipment, chip connection, power module substrate attachment, filter connector and electronic component assembly and other fields. Solder preforms are usually used in occasions that have special requirements on the shape and quality of the solder, and can be made into any size and shape to meet customer needs. Solder preforms have the advantages of diverse shapes, good solderability, reduced flux spatter, and precise control of metal usage when used alone, and have been identified ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/36B23K35/3612B23K35/362B23K35/40
Inventor 吴坚吴念祖李天强
Owner 上海华庆焊材技术股份有限公司
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