Low-melting-point and high-bonding-strength TPU (thermoplastic polyurethane) hot melt adhesive membrane and preparation method thereof

A hot melt adhesive film and raw material technology, applied in the directions of polymer adhesive additives, non-polymer adhesive additives, adhesives, etc., can solve the problems of poor bonding strength and high melting point, and achieve long-lasting bonding and bonding. Simple process, high moisture permeability and high hydrostatic pressure resistance

Active Publication Date: 2015-01-07
DONGGUAN XIONGLIN NEW MATERIAL TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has been found in actual production that the bonding strength of this TPU film attached to fabrics, sh

Method used

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  • Low-melting-point and high-bonding-strength TPU (thermoplastic polyurethane) hot melt adhesive membrane and preparation method thereof
  • Low-melting-point and high-bonding-strength TPU (thermoplastic polyurethane) hot melt adhesive membrane and preparation method thereof
  • Low-melting-point and high-bonding-strength TPU (thermoplastic polyurethane) hot melt adhesive membrane and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0033] Example 1

[0034] A TPU hot-melt adhesive film with low melting point and high bonding strength, which is prepared in parts by weight from the following raw materials:

[0035]

[0036] The tackifier is petroleum resin.

[0037] The filler is kaolin.

[0038] The thickness of the adhesive film is 0.03-2mm, and the thickness of the adhesive film is uniform, which can be changed according to the thickness of the composite board.

[0039] The method for preparing TPU hot melt adhesive film with low melting point and high bonding strength as described above, the method includes the following steps:

[0040] (1) Dry the ingredients of the formula at 80-100°C;

[0041] (2) Extruding the dried raw material, cooling, winding, and packaging to obtain a TPU hot melt adhesive film.

[0042] Among them, an extruder is used for extrusion. The barrel temperature of the extruder is 120°C, 127°C, 155°C, 155°C, 147°C and 140°C, and the die temperature is, for example, 134°C, 131°C, and 131°C. ℃, 1...

Example Embodiment

[0043] Example 2

[0044] A TPU hot-melt adhesive film with low melting point and high bonding strength, which is prepared in parts by weight from the following raw materials:

[0045]

[0046] The tackifier is petroleum resin and rosin resin.

[0047] The filler is polytetrafluoroethylene powder.

[0048] The thickness of the adhesive film is 0.03-2mm, and the thickness of the adhesive film is uniform, which can be changed according to the thickness of the composite board.

[0049] The method for preparing TPU hot melt adhesive film with low melting point and high bonding strength as described above, the method includes the following steps:

[0050] (1) Dry the ingredients of the formula at 80-100°C;

[0051] (2) Extruding the dried raw material, cooling, winding, and packaging to obtain a TPU hot melt adhesive film.

[0052] Among them, an extruder is used for extrusion. The barrel temperature of the extruder is 120°C, 127°C, 155°C, 155°C, 147°C and 140°C, and the die temperature is, for...

Example Embodiment

[0053] Example 3

[0054] A TPU hot-melt adhesive film with low melting point and high bonding strength, which is prepared in parts by weight from the following raw materials:

[0055]

[0056]

[0057] The tackifier is acrylic modified rosin, terpene resin, phenol resin, terpene-phenol resin and terpene phenol resin.

[0058] The filler is an organic filler and an inorganic filler, the inorganic filler is selected from calcium carbonate and kaolin, and the organic filler is selected from polytetrafluoroethylene powder, polyphenylene sulfide and polyethersulfone powder.

[0059] The thickness of the adhesive film is 0.03-2mm, and the thickness of the adhesive film is uniform, which can be changed according to the thickness of the composite board.

[0060] The method for preparing TPU hot melt adhesive film with low melting point and high bonding strength as described above, the method includes the following steps:

[0061] (1) Dry the ingredients of the formula at 80-100°C;

[0062] (2) E...

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Abstract

The invention provides a TPU (thermoplastic polyurethane) hot melt adhesive membrane. The TPU hot melt adhesive membrane is mainly prepared from the following raw materials in parts by weight: 100 parts of TPU, 30-50 parts of thermoplastic polyester of which the melting point is 90-105 DEG C, 10-30 parts of a tackifier, 5-25 parts of a filling material and 5-30 parts of a functional auxiliary agent. The hot melt adhesive membrane prepared by using the method provided by the invention is of a thermoplastic adhesive, is uniform in thickness and simple in bonding process, is suitable for bonding by adopting an automatic production line, is high in production efficiency and large in peeling strength after bonding, can resist water, heat and salt fog aging in an outdoor harsh environment, is durable in bonding, and can be used for significantly improving the bonding strength of the hot melt adhesive membrane adhered to fabrics.

Description

technical field [0001] The invention relates to a TPU hot-melt adhesive film with a low melting point and high bonding strength and a preparation method thereof. Background technique [0002] Hot melt adhesives currently used in the market include ethylene-vinyl acetate copolymer (EVA), polyamide (PA), copolyester (PET), polyethylene (PE) and polyurethane (PU). Melt adhesive pellets, hot melt adhesive powder, hot melt adhesive sticks and hot melt adhesive films, these hot melt adhesive products are widely used in industries such as automobiles, electronics, construction, light industry and textiles. For the bonding between materials in the form of large-scale lamination, hot-melt adhesive films are widely used due to their high efficiency and convenient construction. [0003] Polyurethane hot-melt adhesive film has the advantages of convenient positioning and high peel strength. It is a hot-melt adhesive with excellent adhesion and sealing performance. It has developed rapi...

Claims

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Application Information

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IPC IPC(8): C09J7/00C09J175/04C09J167/00C09J11/08C09J11/04
Inventor 王一良何健雄
Owner DONGGUAN XIONGLIN NEW MATERIAL TECH
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