Evaporation source component, film deposition device and film deposition method

A technology of evaporation sources and components, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as uneven film thickness, unbalanced saturated vapor pressure, and low material utilization

Inactive Publication Date: 2014-10-15
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using this point evaporation source to evaporate thin films, the material utilization rate is low, generally less than 10%; the thin film uniformity is poor, generally less than 10%, and the calculation formula of film uniformity is: (maximum film thickness - minimum film thickness) / (maximum film thickness thickness + minimum film thickness)
That is, the saturated vapor pressure in the chamber is unbalanced, resulting in uneven thickness of the film plated on the substrate 30, especially the uniformity of the film thickness on both sides of the substrate 30 is even worse.
When making large-scale films, the defects of poor coating uniformity of traditional single-point linear evaporation sources are more obvious

Method used

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  • Evaporation source component, film deposition device and film deposition method
  • Evaporation source component, film deposition device and film deposition method
  • Evaporation source component, film deposition device and film deposition method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Such as figure 2 As shown, the first embodiment of the present invention provides an evaporation source assembly for evaporating a thin film on a substrate 30 . The evaporation source assembly includes: a body 130, the body 130 includes a top member 131, a bottom member 132 and a side wall 133 surrounding a cavity 134, the bottom member 132 is provided with a plurality of input ports 1321 communicating with the cavity 134; A nozzle 140, arranged on the top member 131 and communicated with the cavity 134; a plurality of evaporators 110, each evaporator 110 is arranged below the body 130 and corresponds to an input port 1321, each evaporator 110 includes Opening 111, the evaporator 110 communicates with the corresponding input port 1321 through the opening 111, the evaporator 110 is used to accommodate and evaporate the material to be evaporated; one end of a plurality of connecting pipes 150 communicates with the evaporator 110 The other end of the opening 111 communic...

Embodiment 2

[0051] Figure 5 Shown is the evaporation source assembly provided by the second embodiment of the present invention, which is basically the same as the evaporation source assembly provided by the first embodiment, the only difference is that the evaporation source assembly of the second embodiment also includes an exhaust gas Pipe 160, gas collection box 170, three-way valve 180. The three-way valve 180 has three ports, the first port communicates with the evaporator 110, the second port communicates with the cavity 134 of the body 130, the third port communicates with one end of the exhaust pipe 160, and the other end of the exhaust pipe 160 It communicates with the gas collecting box 170 . In the third embodiment, the evaporator 110 , the cavity 134 and the exhaust pipe 160 can communicate with each other through a three-way valve 180 .

[0052] When the evaporation source assembly is working, the first port and the second port of the three-way valve 180 are opened, and t...

Embodiment 3

[0056] The present invention also provides a thin film deposition device, comprising a vacuum chamber and the evaporation source assembly described in Embodiment 1 or 2 arranged in the vacuum chamber. The thin film deposition device uses the above-mentioned evaporation source components, the material utilization rate is greater than 30%, and the film uniformity is less than ±3%.

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Abstract

The invention provides an evaporation source component used for vapor plating of a film to a substrate. The evaporation source component includes: a body, which consists of a top member, a bottom member and a side wall that surround a cavity, with the bottom member being provided with a plurality of input ports communicated with the cavity; a plurality of nozzles, which are arranged on the top member and are communicated with the cavity; a plurality of evaporators, each of which is arranged below the body and corresponding to an input port, includes an opening part and is communicated with the corresponding input port through the opening part, and is used for accommodating and evaporating the material to be subjected to vapor plating; and a plurality of connecting pipes, which are used for connecting the opening parts of the evaporators and the input ports of the body respectively, are cone-shaped pipes wide at the top and narrow at the bottom, and are used for accelerating the atmosphere balance of steam of the vapor plating in the body. The invention also provides a film deposition device and a film deposition method.

Description

technical field [0001] The invention relates to the field of light emitting diodes, in particular to an evaporation source component, a thin film deposition device and a thin film deposition method for making organic light emitting diodes. Background technique [0002] At present, the production of OLED components is still dominated by thermal evaporation, and both evaporation source manufacturers and users are committed to improving the performance of evaporation sources, hoping to improve material utilization, reduce material costs, and improve the performance of OLED components. For example, the uniformity of the thickness of the evaporated film, etc. [0003] The existing types of evaporation sources used in thermal evaporation process mainly include point evaporation sources, cluster line evaporation sources, single point linear evaporation sources and surface evaporation sources. The point evaporation source includes a crucible for placing evaporation materials, and t...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): C23C14/24H10K99/00
CPCH01L51/001C23C14/243H01L51/0002H10K71/164
Inventor林进志周皓煜黄俊允
OwnerEVERDISPLAY OPTRONICS (SHANGHAI) CO LTD