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Multi-Level semiconductor package

A semiconductor and bonding layer technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as interconnection layout that limits electrical conductivity and thermal conductivity performance

Active Publication Date: 2014-10-15
INFINEON TECH AUSTRIA AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional molded packages provide all the leads in the package on the same layer, limiting the electrical and thermal conductivity performance and interconnect layout in the package

Method used

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  • Multi-Level semiconductor package
  • Multi-Level semiconductor package
  • Multi-Level semiconductor package

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Experimental program
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Embodiment Construction

[0015] Embodiments described herein provide a semiconductor package having leads terminated at different layers in the package. At least one connector is included in the package for connecting the one or more semiconductor die electrodes to leads that terminate at the same layer in the package as the connector. Thus, the connector can have a single continuous planar structure with leads extending to the planar connector, rather than a connector that has to bend down towards the same base layer of the package where typically all of the package's leads terminate here. Multiple connectors may be provided having a single continuous planar structure so that multiple die electrodes may be connected to different package leads at multiple levels in the package, each level being arranged generally planarly. Providing leads at different layers in a semiconductor package, and using a single continuous planar structure of connectors for electrode-to-lead connections of the die, improves ...

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Abstract

The invention relates to a multi-Level semiconductor package. The semiconductor package includes a semiconductor die having a first electrode at a first side and a second electrode at a second side opposing the first side, a first lead under the semiconductor die and connected to the first electrode at a first level of the package, and a second lead having a height greater than the first lead and terminating at a second level in the package above the first level, the second level corresponding to a height of the semiconductor die. A connector of a single continuous planar construction over the semiconductor die and the second lead is connected to both the second electrode and the second lead at the same second level of the package.

Description

technical field [0001] This application relates to semiconductor packaging, and more particularly to multilayer semiconductor packaging. Background technique [0002] Increases in the integration density of electronic components and the associated greater need for thermal and electrical conductivity require new connection technologies with better thermal and electrical conductivity and also require structural technologies for the corresponding connection elements . In recent years, metal clips have gained popularity in wire bonds for providing electrical connections between semiconductor die (chip) electrodes and molded package leads. The metal clips provide a large area connection between the package leads and the die electrodes, allowing for an increase in the electrical and thermal conductivity of the package compared to wire bonds. However, traditional molded packages provide all the leads in the package on the same layer, limiting the electrical and thermal conductivi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49
CPCH01L2224/73221H01L2224/73265H01L21/56H01L24/41H01L2924/1305H01L2924/13062H01L2224/48091H01L2224/40245H01L2224/73263H01L24/40H01L24/48H01L2924/13055H01L23/49575H01L2224/32245H01L23/48H01L23/49562H01L24/33H01L23/3107H01L2924/13091H01L23/051H01L23/49524H01L2224/48247H01L2224/48465H01L2924/00014H01L2924/1306H01L2924/181H01L24/73H01L2224/8385H01L2224/83801H01L2224/8485H01L2224/84801H01L2224/45099H01L2924/00012H01L2924/00
Inventor R·奥特雷姆巴J·赫格劳尔K·希斯钟蔡梅
Owner INFINEON TECH AUSTRIA AG
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