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Relative position detection method between die bonder and bonding tool and semiconductor die

A bonding tool and relative position technology, which is applied in semiconductor/solid-state device manufacturing, instruments, measuring devices, etc., can solve the problem of complex optical system composition and achieve the effect of simple composition

Active Publication Date: 2016-11-30
SHINKAWA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is necessary to use a large number of half mirrors or prisms in the optical system, and there is a problem that the composition of the optical system becomes complicated.

Method used

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  • Relative position detection method between die bonder and bonding tool and semiconductor die
  • Relative position detection method between die bonder and bonding tool and semiconductor die
  • Relative position detection method between die bonder and bonding tool and semiconductor die

Examples

Experimental program
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Embodiment Construction

[0060] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Such as figure 1 As shown, the die bonder 10 of the present invention has a bonding head 15 on which a bonding tool 24 is installed through a crank 20, a guide rail 11 for guiding the bonding head 15 in the Y direction, and a Y direction for moving the bonding head 15 in the Y direction. Moving mechanism 13, X-direction moving mechanism 12 for moving guide rail 11 and bonding head 15 in X direction, camera 32 provided under bonding head 15, flashlight 34 as light source, image processing unit connecting camera 32 and flashlight 34 40, and the control unit 50 connected to the X and Y direction moving mechanisms 12 and 13. The bonding tool 24 has an adsorption surface 27 for adsorbing the semiconductor die 30 at its tip, and the strobe lamp 34 includes a reflector 35 for directing emitted light toward the bonding tool 24 . The bonding head 15 internally includes a Z-direc...

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PUM

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Abstract

The invention provides a method for detecting the relative position of a grain bonder, a bonding tool, and a semiconductor crystal grain. The die bonder includes: a bonding tool, a flashlight, a camera, and a crank; the bonding tool has a front-end adsorption surface that absorbs semiconductor die, a base that is thicker than the front-end adsorption surface, and a connection between the adsorption surface and the base that is inclined relative to the center line in the long-side direction The camera (32) simultaneously acquires the image of the semiconductor crystal grains adsorbed on the adsorption surface, the image of the crank and the image of the inclined surface of the bonding tool; the crank is adjacent to the base of the bonding tool, and leaves the focal depth of the camera from the adsorption surface The bonding tool (24) is disposed in the longitudinal direction of the bonding tool (24), and does not move relative to the bonding tool (24), and reflects light from the flash lamp (34). Thereby, the positional displacement of a bonding tool and a semiconductor die can be detected effectively with a simple structure in a die bonder.

Description

technical field [0001] The invention relates to a structure of a die bonder and a method for detecting the relative position of a bonding tool and a semiconductor crystal grain adsorbed at the front end of the bonding tool. Background technique [0002] A die bonder is often used as an apparatus for bonding a semiconductor die to a circuit board such as a lead frame. The die bonder lowers the semiconductor die sucked and held at the tip of the bonding tool toward the surface of the circuit substrate sucked and fixed on the bonding stage, and bonds the semiconductor die to the circuit board. [0003] In the die bonder, it is necessary to press the semiconductor die to the circuit board in a state where the position of the semiconductor die adsorbed by the bonding tool is aligned with the bonding position of the circuit board. Therefore, when the semiconductor die is transferred by the bonding tool, the relative position of the semiconductor die and the circuit board is align...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/52G01B11/00
Inventor 辻正人梅原冲人比留间圭一浦桥亮
Owner SHINKAWA CO LTD
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