Cross-coupled bandpass filter and its design method

Abstract

The invention relates to the field of filter design, is a cross-coupled band-pass filter and a design method thereof, and aims to provide a band-pass filter with excellent performance and small volume. It includes at least three resonant cavities, a signal source and a load terminal, a rectangular waveguide is arranged in the resonant cavity, a diaphragm is arranged in the resonant cavity, and the diaphragm is radially symmetrically arranged. The cross-coupled band-pass filter and its design method provided by the present invention provide a method for designing a miniaturized band-pass filter with excellent performance, by arranging an asymmetrically structured diaphragm and using wave bead electrode coupling as The interface makes the product small in size, light in weight, high in operating frequency, short in wavelength, and excellent in performance; it solves the problem of applying millimeter-wave cavity filters to integrated circuits, greatly expands the application of millimeter-wave devices in integrated circuits, and greatly It opens up the application prospect of 8 millimeter wave devices.

Description

technical field [0001] The invention relates to the field of filter design, in particular to a cross-coupled band-pass filter and a design method thereof. Background technique [0002] In the traditional waveguide filter structure, the diaphragms forming the resonant cavity are symmetrically arranged on both sides of the narrow wall of the waveguide, the coupling window between the cavities is in the middle, and the input and output ends are flanges. The waveguide filter of this structure The volume of the device is large, and it can only be applied in the waveguide transmission system; [0003] There are also probe-type coaxial cables and various conversion connectors, which also have the problems of large size, difficult debugging, and difficulty in matching with microstrip circuits. There are great limitations in the application of millimeter-wave cavity filters to integrated circuits. . [0004] In the production process, the traditional process uses epoxy resin conduc...

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Problems solved by technology

[0003] There are also probe-type coaxial cables and various conversion connectors, which also have the problems of large size, difficult debugging, and difficulty in matching with microstrip circuits. There are great limitations in the application of millimeter-wave cavity filters to integrated circuits.

[0004] In the production engineering, the traditional technology adopts epoxy resin conductive adhesive bonding technology, which has poor bonding firmness and affects technical indicators, especially under vibration conditions, and its performance is more difficult to guarantee.

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