Cross coupling band-pass filter and design method of cross coupling band-pass filter

Abstract

The invention relates to the field of filter design, in particular to a cross coupling band-pass filter and a design method of the cross coupling band-pass filter. The band-pass filter which is excellent in performance and small in size is provided. The cross coupling band-pass filter comprises at least three resonant cavities, a signal source and a load terminal, rectangular waveguides are arranged in the resonant cavities, and transverse diaphragm sheets are arranged in the resonant cavities and are symmetrically arranged in the radial direction. By means of the cross coupling band-pass filter and the design method of the cross coupling band-pass filter, the method for designing the small band-pass filter which is excellent in performance is provided, the transverse diaphragm sheets of asymmetric structures are arranged, a bead electrode is coupled to form an interface, and the product is small in size, light in weight, high in working frequency, short in wave length and excellent in performance; the aim that the millimeter-wave cavity filter is applied to an integrated circuit is achieved, the application scope of the millimeter-wave device in the integrated circuit is greatly expanded, and the application prospect of the 8-millimeter-wave device is greatly expanded.

Description

technical field [0001] The invention relates to the field of filter design, in particular to a cross-coupled band-pass filter and a design method thereof. Background technique [0002] In the traditional waveguide filter structure, the diaphragms forming the resonant cavity are symmetrically arranged on both sides of the narrow wall of the waveguide, the coupling window between the cavities is in the middle, and the input and output ends are flanges. The waveguide filter of this structure The volume of the device is large, and it can only be applied in the waveguide transmission system; [0003] There are also probe-type coaxial cables and various conversion connectors, which also have the problems of large size, difficult debugging, and difficulty in matching with microstrip circuits. There are great limitations in the application of millimeter-wave cavity filters to integrated circuits. . [0004] In the production process, the traditional process uses epoxy resin conduc...

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Problems solved by technology

[0003] There are also probe-type coaxial cables and various conversion connectors, which also have the problems of large size, difficult debugging, and difficulty in matching with microstrip circuits. There are great limitations in the application of millimeter-wave cavity filters to integrated circuits.

[0004] In the production engineering, the traditional technology adopts epoxy resin conductive adhesive bonding technology, which has poor bonding firmness and affects technical indicators, especially under vibration conditions, and its performance is more difficult to guarantee.

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