Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Microfluidic bubble removal device and preparation method thereof as well as microfluidic device

A bubble removal and microfluidic technology, applied in the direction of liquid degassing, separation methods, chemical instruments and methods, etc., can solve the problems of difficult application of microgravity environment and low exhaust efficiency, so as to overcome the dependence on gravity and improve exhaust Efficiency, the effect of meeting exhaust requirements

Inactive Publication Date: 2014-12-24
TSINGHUA UNIV +1
View PDF8 Cites 31 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of this, the present invention provides a bubble removal device and its preparation method as well as microfluidic devices to overcome the problems of low exhaust efficiency and difficulty in applying to microgravity environment in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microfluidic bubble removal device and preparation method thereof as well as microfluidic device
  • Microfluidic bubble removal device and preparation method thereof as well as microfluidic device
  • Microfluidic bubble removal device and preparation method thereof as well as microfluidic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In order to make the purpose, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0037] Such as figure 1 , figure 2 , image 3 As shown, the embodiment of the microfluidic bubble removal device of the present invention includes a channel bottom layer 1 and a hydrophobic porous layer 3, wherein the hydrophobic porous layer 3 is located on the channel bottom layer 1, and a channel bottom layer 1 and the hydrophobic porous layer 3 are formed. The microfluidic channel 4, the channel bottom layer 1 is located on one side of the microfluidic channel 4 and has at least one boss bar 2, the boss bar 2 is not in contact with the hydrophobic porous layer 3, the microfluid flows in the microfluidic channel 4, and the raised platform Bar 2 is disturbed due to the obstruction of boss bar 2 (such as figure 1 , figure 2 , image 3 shown ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
pore sizeaaaaaaaaaa
Login to View More

Abstract

The invention discloses a microfluidic bubble removal device and a preparation method thereof as well as a microfluidic device adopting the microfluidic bubble removal device. The microfluidic bubble removal device comprises a channel bottom layer and a porous drainage layer located above the channel bottom layer, wherein a microfluidic channel is formed between the channel bottom layer and the porous drainage layer, and at least one boss strip is arranged on the side, located on the microfluidic channel, of the channel bottom layer. According to the invention, dependence of the traditional microfluidic air removal method on gravity is eliminated, the air removal efficiency can be increased, and the air removal requirement of the microfluidic device in a micro-gravity environment can be met. The microfluidic bubble removal device is integrated with other microfluidic chips easily and can remove bubbles of liquids with different viscosities.

Description

technical field [0001] The invention relates to the technical field of microfluidic chips and microfluidic devices, in particular to a microfluidic bubble removal device for microfluidic devices or chips and a preparation method thereof, and a microfluidic device using the microfluidic bubble removal device. Background technique [0002] Microfluidic chips and microfluidic devices have increasingly important applications in biomedical testing, pharmaceuticals, environmental and food safety monitoring, etc. For microfluidic devices or chips, the liquid transported in the microfluidic channel is accompanied by air bubbles due to the air bubbles caused by the liquid feeding process or the liquid itself contains air bubbles. The existence of air bubbles will directly affect the transport control, biochemical reaction and detection of liquid in the microfluidic channel. Therefore, it is necessary to discharge the air bubbles from the liquid transported in the microfluidic channel...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B01D19/00B01L3/00
Inventor 叶雄英李子尚谢帅王春艳姚宇华谭映军成一诺马增帅刘跃宋晋忠
Owner TSINGHUA UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com