The device used to cooperate with the feeding machine of the high-speed electroplating production line
A high-speed electroplating and production line technology, applied in the electrolysis process, electrolysis components, etc., can solve problems such as CPK of electroplating products that affect semiconductor lead frames
Active Publication Date: 2016-08-10
苏州矽微电子科技有限公司
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Problems solved by technology
[0002] For semiconductor lead frames, in recent years, high-speed electroplating production lines are generally used instead of rack plating production lines to improve productivity. However, when feeding materials, there are gaps between semiconductor lead frames, which affects the CPK of electroplating products for semiconductor lead frames. Therefore, there is a high demand for a loading device that enables zero gap between semiconductor lead frames when loading
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[0017] Describe the present invention in detail below in conjunction with accompanying drawing and preferred embodiment:
[0018] Such as figure 1 , 2 Shown in and 3, the present invention is used to cooperate the device of high-speed electroplating production line feeder, comprises PLC7 with high-speed counter 8, rotary encoder 1 and pin wheel 2, and described pin wheel 2 is connected with rotary encoder by rotating shaft 3 1 connection, the rotary encoder 1 is electrically connected to the high-speed counter 8 on the PLC7, the number of positioning pins 4 on the pin wheel 2 is 18, and the positioning pins 4 are equidistant and vertically distributed on the pin wheel 2 On the same circle, the arc length distance between the adjacent positioning pins 4 is equal to the distance between the adjacent holes 5 on the conveyor belt 9 on the high-speed electroplating production line, and the positioning pins 4 are conical. The arc length distance between the adjacent positioning pi...
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Abstract
The invention discloses a device for cooperating with a feeder on a high-speed electroplating production line, comprising a PLC with a high-speed counter, a rotary encoder and a pin wheel, the pin wheel is connected with the rotary encoder through a rotating shaft, and the rotary The encoder is electrically connected to the high-speed counter on the PLC, the needle wheel is provided with a certain number of positioning pins, the positioning pins are vertically distributed on the same circle of the needle wheel at equal distances, and the adjacent positioning pins are The arc length between them is an integer multiple of the distance between adjacent holes on the conveyor belt on the high-speed electroplating production line. It can make the gap between semiconductor lead frames close to zero during loading.
Description
technical field [0001] The invention belongs to the technical field of semiconductor lead frame feeding, and in particular relates to a device suitable for cooperating with a feeding machine of a high-speed electroplating production line. Background technique [0002] For semiconductor lead frames, in recent years, high-speed electroplating production lines are generally used instead of rack plating production lines to improve productivity. However, when feeding materials, there are gaps between semiconductor lead frames, which affects the CPK of electroplating products for semiconductor lead frames. Therefore, there is a high demand in the market for a loading device that enables zero gap between semiconductor lead frames during loading. Contents of the invention [0003] In view of the above problems, the object of the present invention is to provide a feeding device capable of reducing the gap between semiconductor lead frames during feeding. [0004] In order to achie...
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IPC IPC(8): C25D17/00C25D7/00
Inventor 钟小龙贾淳
Owner 苏州矽微电子科技有限公司