A Phosphor Powder Coating Method Precisely Controlling the Coating Area

A precise control, phosphor technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of large coverage, affecting the luminous effect, sealing defects, etc., to achieve the effect of controlling the uniformity of spraying

Inactive Publication Date: 2017-10-31
SHENZHEN REFOND OPTOELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Compared with the method without a baffle, the spraying area is reduced when the baffle is set, but the coverage is still large, which may easily lead to uneven spraying, thereby affecting the luminous effect, and there is a capillary channel between the baffle and the substrate. Fluorescent glue 3a is easy to penetrate, and it is easy to cause sealing defects and affect the luminous effect

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  • A Phosphor Powder Coating Method Precisely Controlling the Coating Area
  • A Phosphor Powder Coating Method Precisely Controlling the Coating Area
  • A Phosphor Powder Coating Method Precisely Controlling the Coating Area

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Embodiment Construction

[0013] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0014] A phosphor coating method for precisely controlling the coating area provided by an embodiment of the present invention includes the following steps:

[0015] Fix the LED substrate and complete the positioning of the LED substrate;

[0016] Place the first baffle for avoiding the gold wire and the wafer, the gold wire and the wafer are exposed outside, and the purpose of protecting the gold wire and the wafer is achieved through the height of the first baffle;

[0017] Place the second baffle plate that is provided with spraying holes above the first baffle plate, the height of the second b...

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Abstract

The present invention is applicable to the LED powder spraying process, and provides a phosphor coating method for accurately controlling the coating area, which includes the following steps: fixing the LED substrate; placing a first baffle for avoiding the gold wire and the chip; Place the second baffle with the spray hole above the first baffle, and make the height of the second baffle higher than the highest point of the gold wire and the wafer, so that the spray hole is facing the LED chip, and the The size and shape of the spray hole matches the size and shape of the wafer; adjust the spray head so that the spray head is spraying the spray hole. In the present invention, the wafer is placed directly under the spraying hole, and the shape and size of the spraying hole match the wafer directly below, thereby accurately determining the spraying area through the size of the spraying hole, and effectively controlling the spraying through the shape design of the spraying hole Evenness.

Description

technical field [0001] The invention relates to LED spraying technology, in particular to a fluorescent powder coating method for precisely controlling the coating area. Background technique [0002] At present, white light LEDs are mostly packaged with blue light chips and phosphor powder. Phosphor powder coating mainly includes fluorescent glue dispensing technology and phosphor powder spraying technology. For products that do not have a bowl to carry fluorescent glue, the phosphor powder spraying technology is basically used, but the existing phosphor powder spraying will cover the entire substrate of the LED packaging product. Some will use a simple baffle to protect the gold wire and chip from the air, and press the baffle on the LED substrate, but the exposed area of ​​the substrate is still large, and most of the substrate will still be coated with phosphor. Moreover, because there is a certain gap between the baffle and the substrate of the LED packaging product, a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/50
CPCH01L33/50H01L2933/0041H01L2224/8592H01L2224/48091H01L2924/00014
Inventor 李愿曹宇星
Owner SHENZHEN REFOND OPTOELECTRONICS
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