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Release film for use in producing green sheet

A technology of printed circuit board and peeling film, which is applied in the direction of manufacturing tools, synthetic resin layered products, transportation and packaging, etc. It can solve the problems of poor winding, thinning of printed circuit board, adhesion, etc., and prevent local uneven thickness , Excellent peeling effect

Active Publication Date: 2014-12-24
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the case of using the release film for manufacturing a printed circuit board described in Patent Document 1, when the release film for manufacturing a printed circuit board that forms a printed circuit board is wound and stored, there are defects on the inner surface of the release film for manufacturing a printed circuit board. When the relatively rough surface shape is transferred to the printed circuit board and the printed circuit board is locally thinned
As a result, when a capacitor is fabricated by laminating printed circuit boards, there are cases where defects due to short circuits occur
[0007] On the other hand, if the surface roughness of the surface opposite to the surface provided with the release agent layer of the base material is made relatively small, the surface becomes significantly flat, and the internal and external sliding of the release film for printed circuit board production becomes poor. Therefore, defects such as poor winding or sticking may occur

Method used

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  • Release film for use in producing green sheet
  • Release film for use in producing green sheet
  • Release film for use in producing green sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0145] First, prepare a biaxially stretched polyethylene terephthalate film as a substrate [thickness: 38 μm, arithmetic average roughness Ra of the first surface 1 : 42nm, the maximum protrusion height Rp of the first surface 1 : 619nm, the arithmetic mean roughness Ra of the second surface 0 : 42nm, the maximum protrusion height Rp of the second surface 0 : 619nm].

[0146] Then, 94 parts by mass of dipentaerythritol hexaacrylate [solid content 100% by mass] as the active energy ray-curable compound (a1), and 1 part by mass as A polyether-modified acryloyl group-containing polydimethylsiloxane of polyorganosiloxane (b1) [Big Chemical Japan Co., Ltd., trade name "BYK-3500", solid content 100 mass %], and 5 mass As the photopolymerization initiator (c1), α-aminoalkylphenone photopolymerization initiator [made by BASF Corporation, trade name "IRGACURE907", 2-methyl-1[4-(methylthio)phenyl ]-2-morpholinopropan-1-one, solid content 100% by mass] to obtain a release agent layer...

Embodiment 2～4

[0151] Except having changed the thickness of the back surface coating layer and the surface roughness of the back surface of the release film for printed circuit board manufacture as shown in Table 1, it carried out similarly to Example 1, and prepared the release film for printed circuit board manufacture.

Embodiment 5

[0153] Except that the material for forming the back coating layer in Example 1 was changed to 95 parts by mass of dipentaerythritol hexaacrylate as the active energy ray compound (a2) was diluted with isopropyl alcohol / methyl ethyl ketone mixed solvent (mass ratio 3 / 1)[ Solid content 100% by mass], and 5 parts by mass of an α-aminoalkylphenone-based photopolymerization initiator [BASF, trade name "IRGACURE907" as a photopolymerization initiator (c2), 2-methyl-1 [4-(methylthio) phenyl]-2-morpholinopropan-1-one, solid content 100 mass %] the material for forming the back coating layer with a solid content of 20 mass % obtained, and as shown in Table 1 Except having changed the surface roughness of the back surface of the release film for printed circuit board manufacture, it carried out similarly to Example 1, and prepared the release film for printed circuit board manufacture.

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Abstract

This release film for use in producing a green sheet comprises: a substrate having a first surface and a second surfaces; a release agent layer formed by applying a material which comprises (a1) an actinic radiation curable compound and (b1) a polyorganosiloxane to the first surface of the substrate and curing the resulting material; and a back coat layer formed by applying a material which comprises (a2) an actinic radiation curable compound to the second surface of the substrate and curing the resulting material. Further, the release film is characterized in that: the outer surface of the release agent layer has an arithmetic mean roughness (Ra2) of 8nm or less and a maximum protrusion height (Rp2) of 50nm or less; and the outer surface of the back coat layer has an arithmetic mean roughness (Ra3) of 5 to 40nm and a maximum protrusion height (Rp3) of 60 to 500nm. According to the present invention, the occurrence of pinholes or partial thickness irregularities in a green sheet can be minimized.

Description

technical field [0001] This invention relates to the peeling film for printed circuit board manufacture. Background technique [0002] In the manufacture of laminated ceramic capacitors, release films for printed circuit board manufacturing are used to form printed circuit boards. [0003] The release film for printed circuit board manufacture is generally comprised from a base material and a release agent layer. A ceramic slurry obtained by dispersing and dissolving ceramic particles and a binder resin in an organic solvent is coated on the release film for producing a printed circuit board, and the coated product is dried to produce a printed circuit board. By this method, a printed circuit board of uniform thickness can be efficiently manufactured. And the printed circuit board manufactured in this way was peeled from the release film for printed circuit board manufacture, and it was used for manufacture of a laminated ceramic capacitor. [0004] In manufacture of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28B1/30B32B27/00
CPCB28B1/30B32B27/00C09D143/04C08L2203/16C09D183/10C08G77/442Y10T428/24355C09D135/02
Inventor 深谷知巳市川慎也
Owner LINTEC CORP
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