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Coating composition for waterproofing and moistureproofing

A composition and coating technology, applied in coatings, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as unusable

Active Publication Date: 2016-10-19
DAIKIN IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the treatment liquid used in this method, a specific Freon, which is prohibited to be used, is used as a solvent, so it cannot be used at present.

Method used

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  • Coating composition for waterproofing and moistureproofing
  • Coating composition for waterproofing and moistureproofing
  • Coating composition for waterproofing and moistureproofing

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0115] Manufacturing example 1 (Rf (C6) methacrylate / isobornyl methacrylate = 100 / 2.70 weight ratio) copolymer)

[0116] Add 34.08g perfluorohexylethyl methacrylate (CH 2 =C(CH 3 ) COOCH 2 CH 2 C 6 f 13 : hereinafter sometimes abbreviated as "Rf(C6) methacrylate"), 0.92g of isobornyl methacrylate (hereinafter abbreviated as "iBMA") and 66g of perfluorobutyl ethyl ether (C 4 f 9 OC 2 h 5 : sometimes abbreviated as "HFE7200"), nitrogen purge was performed for 10 minutes, and heated to 70°C. 0.136 g of azobisisobutyronitrile (hereinafter sometimes abbreviated as "AIBN") was added thereto, and reacted for 6 hours.

[0117] After cooling to room temperature, the fluoropolymer was precipitated with methanol and dried under reduced pressure. This was diluted with HFE7200 to prepare a solution of a predetermined concentration used in Examples described later.

[0118] The molecular weight of the fluoropolymer obtained by the above method was measured by GPC using a fluori...

manufacture example 2

[0119] Manufacturing example 2 (Rf(C6) methacrylate / iBMA=100 / 5.26 (weight ratio) copolymer)

[0120] Fluoropolymer was synthesized in the same manner as in Production Example 1, except that the amount of Rf(C6) methacrylate used was changed to 33.25 g, the amount of iBMA used was changed to 1.75 g, and the amount of AIBN used was changed to 0.139 g , to prepare the HFE7200 solution of the specified concentration used in the examples described later. The weight average molecular weight of the obtained polymer was 299,400.

manufacture example 3

[0121] Manufacturing example 3 (Rf(C6) methacrylate / iBMA=100 / 8.11 (weight ratio) copolymer)

[0122] A fluoropolymer was synthesized in the same manner as in Production Example 1, except that the amount of Rf(C6) methacrylate used was changed to 32.375 g, the amount of iBMA used was changed to 2.625 g, and the amount of AIBN used was changed to 0.142 g , to prepare the HFE7200 solution of the specified concentration used in the examples described later. The weight average molecular weight of the obtained polymer was 210,200.

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Abstract

The present invention provides a coating composition for water-proofing and moisture-proofing, the composition being characterized by containing (I) a fluorine-containing polymer which has constituent units derived from (1) an acrylic acid ester which has a fluoroalkyl group that is ester bonded to a carboxyl group either directly or via a divalent organic group and which has a substituent group at the alpha-position and (2) a monomer having a high softening point, and (II) a fluorine-based solvent. This coating composition enables a coating film having good water-proofing and moisture-proofing properties to be formed on a variety of materials, especially on electronic components requiring high resistance to chemical corrosion, without impairing the performance thereof.

Description

technical field [0001] The present invention relates to a coating composition capable of imparting excellent water and moisture resistance to various materials. In particular, it relates to a coating composition capable of imparting excellent water resistance and moisture resistance to electronic components without impairing the functions of the electronic components. Background technique [0002] With the increase in performance and miniaturization of electrical and electronic equipment, printed circuit boards on which electronic components such as semiconductor chips are mounted at a high density are assembled inside. These devices are sometimes used in high humidity environments and, for devices used outdoors, are sometimes in direct contact with moisture such as rain. When such moisture adheres to or accumulates on electronic components such as printed circuit boards, abnormal current flows and causes malfunctions. In particular, there is a problem that printed circuit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D133/16
CPCC08F220/24C09D133/16H01L23/293H01L2924/0002H01L2924/00C08F220/1811
Inventor 久保田浩治椛泽诚森田正道山口央基
Owner DAIKIN IND LTD