LED chip mounter

Abstract

The invention discloses an LED chip mounter which comprises a chip mounter body, a chip mounting device, a lamp panel device and at least one feeding device. The lamp panel device is installed on the rear side of the inside of a case, the two ends of the lamp panel device extend out of the left end and the right end of the chip mounter body, the lamp panel device is connected with the chip mounting device, and the chip mounting device is installed in the chip mounter body and is located above the lamp panel device. The feeding device and the lamp panel device are improved, the mode of increasing the feeding speed is combined with the mode of reducing manufacturing procedures, production cost is reduced, labor intensity of operators is reduced, and work efficiency is greatly improved. Accordingly, when feeding is carried out, the positions of LED lamp beads are accurate, an LED lamp panel on the lamp panel device is not prone to deforming, good planeness is achieved and chip mounting quality of the chip mounter is improved.

Description

technical field [0001] The invention relates to LED placement machine equipment, in particular to an LED placement machine. Background technique [0002] LED placement machine is the main equipment for producing LED. The current LED placement machine mainly includes three parts: feeding device, lamp panel device and placement device. When working, the SMT device grabs the LED lamp beads from the feeding device, and then places the captured LED lamp beads on the light board in the light board device for mounting operation, thus completing the LED SMT process. Although the traditional LED placement machine can complete the LED placement process, it still has the following technical defects: 1. In order to ensure the placement quality, this results in low placement efficiency; 2. The placement device absorbs LED lights from the feeding device When the LED lamp beads are placed in the feeding device, there is uncertainty, resulting in low precision of the placement of the LED ...

AI Technical Summary

Problems solved by technology

Although the traditional LED placement machine can complete the LED placement process, it still has the following technical defects: 1. In order to ensure the placement quality, this results in low placement efficiency; 2. The placement device absorbs LED lights from the feeding device When the LED lamp beads are placed in the feeding device, there is uncertainty, resulting in low precision of the placement of the LED lamp beads, which affects the quality of the placement; 3. When the feeding device is feeding, it is necessary to carry out the tape loading An intermediate link, which increases the working time, not only leads to low work efficiency, but also increases production costs; 4. When the SMT device puts the LED light board on the light board device for mounting operations, the LED light board is easily deformed, and the LED light The flatness of the board is poor when it is working, resulting in an unsatisfactory patch effect

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