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Circuit board low-temperature fault locating method and heating device thereof

A fault location and heating device technology, applied in the direction of single semiconductor device testing, etc., can solve the problems of high cost and difficult troubleshooting, achieve accurate positioning, avoid manual work, and achieve accurate temperature control

Inactive Publication Date: 2015-01-21
LUOYANG INST OF ELECTRO OPTICAL EQUIP OF AVIC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a circuit board low-temperature fault location method and its heating device to solve the problems of difficulty and high cost of troubleshooting in the prior art

Method used

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  • Circuit board low-temperature fault locating method and heating device thereof
  • Circuit board low-temperature fault locating method and heating device thereof
  • Circuit board low-temperature fault locating method and heating device thereof

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Embodiment Construction

[0020] The low-temperature fault location method of the circuit board is to use the electric heating sheet to heat locally for low-temperature troubleshooting, so the heating device needs to be selected first. Such as figure 2 As shown, the heating device includes a power supply, n button switches and n heating chips, and there are n heating chip branches on the power supply, and each heating chip branch is controlled by a button switch and connected to a heating chip. n button switches (numbered K1, K2, K3...Kn, n is a natural number, it is recommended that n is not greater than 8), n heating chips (numbered R1, R2, R3...Rn), the positive pole of the power supply is connected to the The switches K1, K2, K3...1 pin of Kn, 2 pins of K1 connect to 1 pin of R1, 2 pins of K2 connect to 1 pin of R2, 2 pins of K3 connect to 1 pin of R3,...Kn 2 pins The pin is connected to the 1st pin of Rn, and the 2nd pin of R1, R2, R3... Rn is connected to the negative pole of the power supply. ...

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Abstract

The invention relates to a circuit board low-temperature fault locating method and a heating device thereof. The method comprises the following steps: a heating sheet of the heating device is arranged on a suspected faulty chip of a faulty board; the faulty board is placed in a cooling device, and the temperature is decreased to a set temperature; the suspected faulty chip is heated by the heating device; after the suspected faulty chip is heated for a specified period of time, whether the fault of the faulty board disappears is detected, and the suspected faulty chip is a faulty chip if the fault disappears; and if the fault does not disappear, no fault occurs to the suspected faulty chip. Low-temperature fault removal is carried out through local heating by the electric heating sheet. A faulty chip of a circuit board can be accurately located in a low-temperature environment. A circuit fault is enabled to reappear and disappear by making a faulty chip work in different temperature states. Temperature control is accurate. Blind chip replacement and manual operation in a low-temperature environment are avoided. Time and manpower and material costs are saved. A low-temperature faulty chip can be accurately located.

Description

technical field [0001] The invention belongs to the technical field of electronic testing, and relates to a circuit board low-temperature fault location method and a heating device thereof. Background technique [0002] With the development of electronic technology and communication technology, the size of electronic products is getting smaller and higher, the size of components is getting smaller and smaller, and more and more surface mount devices SMD are used, which makes the circuit The density of board assembly is getting higher and higher, and fault location is becoming more and more difficult, especially for high-density circuit boards with double-sided surface mounts. It is difficult to reach into the high and low temperature box for testing, and it is also difficult for troubleshooting personnel to work in a low temperature environment for a long time, which makes low temperature troubleshooting of circuit boards extremely difficult. The traditional troubleshooting...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26
Inventor 段知晓王宏刚韦双
Owner LUOYANG INST OF ELECTRO OPTICAL EQUIP OF AVIC
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