Semiconductor power modules and devices
A technology of transistors and conductive layers, applied in semiconductor devices, circuit devices, semiconductor/solid-state device components, etc., can solve the problems of increasing overall cost and complexity, and reducing circuit performance.
Active Publication Date: 2015-01-28
TRANSPHORM INC
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Problems solved by technology
While soft switching can alleviate these problems in some cases, the circuitry required for soft switching often includes many additional components, resulting in increased overall cost and complexity
Soft switching also typically requires the circuit to be configured to switch only at specific times when zero current or zero voltage conditions are met, thus limiting the applicable control signals and degrading circuit performance in many cases
Method used
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[0035] Described herein are electronic assemblies and methods suitable for maintaining low levels of EMI in electronic power switching circuits, allowing for greater circuit stability and improved performance. The described electronic components may also have a reduced size compared to conventional components, allowing for lower manufacturing costs.
[0036] Transistors or other switching devices in the circuits described herein are typically configured to switch hard at very high switching rates (ie, with very short switching times) as previously described. When the transistor of one of the circuits in this article is off without significant current flowing through it, it usually supports a voltage close to the high voltage of the circuit. When the transistor in one of the circuits in this article is on, there is usually a lot of current flowing through it and only a small voltage across it. The switching times of the switching transistors switched under hard switching condi...
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An electronic component is described which includes a first transistor encased in a first package, the first transistor being mounted over a first conductive portion of the first package, and a second transistor encased in a second package, the second transistor being mounted over a second conductive portion of the second package. The component further includes a substrate comprising an insulating layer between a first metal layer and a second metal layer. The first package is on one side of the substrate with the first conductive portion being electrically connected to the first metal layer, and the second package is on another side of the substrate with the second conductive portion being electrically connected to the second metal layer. The first package is opposite the second package, with at least 50% of a first area of the first conductive portion being opposite a second area of the second conductive portion.
Description
technical field [0001] The present invention relates to the arrangement of electronic modules formed from semiconductor electronic devices. Background technique [0002] Power switching circuits, such as bridge circuits, are commonly used in a variety of applications. exist figure 1 A circuit schematic diagram of a three-phase bridge circuit 10 configured to drive an electric motor is shown in . Each of the three half-bridges 15, 25 and 35 in circuit 10 comprises two bridges respectively capable of blocking voltage in a first direction and conducting current in a first direction or alternatively in both directions. Transistors 41 and 42, 43 and 44, 45 and 46. In applications where the transistors employed in bridge circuit 10 are only capable of conducting current in one direction, for example when using silicon IGBTs, anti-parallel diodes (not shown) may be connected to each of transistors 41 to 46 . Each of transistors 41 to 46 is capable of blocking a voltage at least...
Claims
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IPC IPC(8): H01L25/16H01L25/065H01L23/48
CPCH03K17/164H05K2201/10015H05K2201/10545H01L23/642H01L25/074H05K1/0263H01L23/552H05K1/0218H01L2224/48091H01L25/16H01L2924/30107H05K2201/10166H03K2217/0045H01L2924/13055H01L2224/73265H01L2924/00014H01L2924/00H01L23/12H01L23/3675H01L25/165H01L25/50H01L27/0883H01L29/2003H01L29/7827H01L23/49822H01L23/49827H01L23/49844H01L25/117H05K1/162
Inventor 吴毅锋
Owner TRANSPHORM INC