Semi-automatic inserter for plasma vapor deposition

Abstract

A semiautomatic substrate inserting machine for plasma vapor deposition comprises a substrate storing cassette for storing a substrate, a rail arranged between the substrate storing cassette and a PECVD furnace, a rail car, a mechanical arm, a substrate sucking machine and a driving unit; the rail car is arranged on the rail, moves along the rail and goes back and forth between the first position close to the substrate storing cassette and the second position close to the PECVD furnace; the mechanical arm is fixed to the rail car and is provided with a working end; the substrate sucking machine is fixed to the working end and is used for sucking a substrate; and the driving unit is used for providing energy for the rail car, the mechanical arm and the substrate sucking machine. With the structure, mounting work of the substrate can be completed in a semiautomatic manner; troubles of manual substrate carrying and manual substrate aligning are removed; the production cost is reduced; the working efficiency and the substrate aligning precision are greatly improved; and the excellent quality and appearance of a coated product are ensured.

Description

technical field [0001] The invention relates to a semi-automatic inserting machine for vapor deposition, in particular to a semi-automatic inserting machine for plasma vapor deposition. Background technique [0002] PECVD, the full name is Plasma Enhanced Chemical Vapor Deposition, that is: plasma enhanced chemical vapor deposition method. PECVD uses microwave or radio frequency to ionize the gas containing the constituent atoms of the film, and locally forms plasma, which is highly chemically active and easy to react, and deposits the desired film on the substrate. In order to enable the chemical reaction to proceed at a lower temperature, the activity of the plasma is used to promote the reaction, so this CVD is called plasma vapor deposition. [0003] The existing PECVD deposition method is to use the top air to pass through the gas sieve plate and then enter the reactor, and the substrate is installed by inserting. As an important part of the PECVD coating production p...

AI Technical Summary

Problems solved by technology

[0004] During the insertion process of the substrate, the processed substrate needs to be moved to the front of the reaction furnace and positioned. However, in the prior art, manual operations are generally used to realize this process, which greatly affects the work efficiency and wastes a lot of manpower. cost; in addition, using manual methods for moving and aligning operations not only requires a large workload, but also inaccurate alignment will affect the quality and appearance of coated products

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