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Lead frame circuit and manufacturing method thereof

A lead frame and circuit technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve problems such as environmental pollution, troublesome soldering and fixing processes, etc., and achieve the effects of speeding up the production cycle, benefiting environmental protection, and moderate prices

Active Publication Date: 2017-04-26
SUZHOU KEYTEC PRECISION COMPONENTS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]Soldering is not only troublesome, but also has certain environmental pollution, and all rely on PCB boards for soldering, but the manufacturing process of PCB boards is based on heavy chemical industry Yes, it also has certain pollution to the environment

Method used

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  • Lead frame circuit and manufacturing method thereof
  • Lead frame circuit and manufacturing method thereof
  • Lead frame circuit and manufacturing method thereof

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Experimental program
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Embodiment Construction

[0028] The specific embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0029] The stamping process is a standard manufacturing method that produces metal products of any shape. The leadframes of the present invention can be manufactured using a stamping process, stamping the desired shape on a flat strip metal sheet, in some cases requiring flex contacts.

[0030] like figure 2 Shown is the structural schematic diagram of the lead frame of the present invention, four lead frames 4 are punched on the metal plate 1 (of course, the number of lead frames is punched according to the length of the metal plate), and the outer side of the metal plate 1 is punched with positioning Hole 3, can be used for automated high-speed production. The lead frame 4 includes four bases: a first base 51, a second base 52, a third base 53, and a fourth base 54. The first base 51 is C-shaped, and the first base 51 is provided with a connect...

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PUM

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Abstract

The invention discloses a lead frame circuit, comprising a lead frame and electrical components connected to the lead frame, the lead frame is composed of at least two substrates, the substrates are connected by a base bridge, and the substrate is provided with a Fixing port for fixing electrical components. The lead frame can be used to replace the printed circuit board. The structure and shape of the lead frame are not limited, and no soldering process is required between the lead frame and the electrical components. The electrical components and the lead frame are mechanically connected and fixed, which reduces production costs and does not Pollution of the environment is conducive to environmental protection.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a lead frame circuit and a manufacturing method thereof. Background technique [0002] Almost all electrical circuits today require passive or active components that consist of conductive circuit substrates (printed circuit boards (PCBs). The manufacturing process of these printed circuit boards is a heavy chemical based process with multiple steps and sub-steps. figure 1 It is a flow chart of the manufacturing process of printed circuit boards. The manufacturing process of printed circuit boards is very cumbersome and based on heavy chemical industry, which has adverse effects on the environment and so on. Moreover, due to the nature of the assembly process and components, the PCB must be soldered to fix the components, usually wave soldering. [0003] Soldering is not only a troublesome process, but also has certain environmental pollution, and all rely on...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L21/48
Inventor 马蒂纳斯·约翰内斯·柏图斯·兰耿唐卡
Owner SUZHOU KEYTEC PRECISION COMPONENTS
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