Unlock instant, AI-driven research and patent intelligence for your innovation.

Lead wire framework circuit and manufacturing method of lead wire framework circuit

A lead frame and circuit technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve problems such as environmental pollution, troublesome soldering and fixing processes, etc., and achieve the effects of speeding up the production cycle, benefiting environmental protection, and moderate prices

Active Publication Date: 2015-02-11
SUZHOU KEYTEC PRECISION COMPONENTS
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]Soldering is not only troublesome, but also has certain environmental pollution, and all rely on PCB boards for soldering, but the manufacturing process of PCB boards is based on heavy chemical industry Yes, it also has certain pollution to the environment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lead wire framework circuit and manufacturing method of lead wire framework circuit
  • Lead wire framework circuit and manufacturing method of lead wire framework circuit
  • Lead wire framework circuit and manufacturing method of lead wire framework circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The specific embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0029] The stamping process is a standard manufacturing method that produces metal products of any shape. The leadframes of the present invention can be manufactured using a stamping process, stamping the desired shape on a flat strip metal sheet, in some cases requiring flex contacts.

[0030] Such as figure 2 Shown is the structural schematic diagram of the lead frame of the present invention, four lead frames 4 are punched on the metal plate 1 (of course, the number of lead frames is punched according to the length of the metal plate), and the outer side of the metal plate 1 is punched with positioning Hole 3, can be used for automated high-speed production. The lead frame 4 includes four bases: a first base 51, a second base 52, a third base 53, and a fourth base 54. The first base 51 is C-shaped, and the first base 51 is provided with ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a lead wire framework circuit, which comprises a lead wire framework and an electric element connected onto the lead wire framework, wherein the lead wire framework consists of at least two base bodies, the base bodies are connected through a base bridge, and each base body is provided with a fixing opening for fixing the electric element. The lead wire framework can be used for replacing a printed circuit board, the structure and the shape of the lead wire framework are not limited, in addition, a tin welding process is not needed between the lead wire framework and the electric element, the electric element is fixedly connected with the lead wire framework in a mechanical mode, the production cost is reduced, the environment is not polluted, and the environment protection is favorably realized.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a lead frame circuit and a manufacturing method thereof. Background technique [0002] Almost all electrical circuits today require passive or active components that consist of conductive circuit substrates (printed circuit boards (PCBs). The manufacturing process of these printed circuit boards is a heavy chemical based process with multiple steps and sub-steps. figure 1 It is a flow chart of the manufacturing process of printed circuit boards. The manufacturing process of printed circuit boards is very cumbersome and based on heavy chemical industry, which has adverse effects on the environment and so on. Moreover, due to the nature of the assembly process and components, the PCB must be soldered to fix the components, usually wave soldering. [0003] Soldering is not only a troublesome process, but also has certain environmental pollution, and all rely on...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L21/48
Inventor 马蒂纳斯·约翰内斯·柏图斯·兰耿唐卡
Owner SUZHOU KEYTEC PRECISION COMPONENTS
PatSnap Eureka logo

PatSnap Eureka turns technology decisions into work you can execute. Powered by our Innovation Knowledge Graph, it runs expert workflows across engineering, life sciences, materials and intellectual property. Get your review-ready output in minutes.

X (Twitter)LinkedInYouTubeSubstack

© 2026 PatSnap. All rights reserved. 

Terms of Service

 | 

Privacy policy

 | 

Modern Slavery Act Transparency Statement