Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit board card temperature tolerance analysis method

An analysis method and temperature resistance technology, applied in the field of circuit board temperature resistance analysis, can solve the problems of PCIE board performance degradation and failure, and achieve the effect of reducing the cost of test equipment

Active Publication Date: 2015-03-04
BEIJING JINGDONG SHANGKE INFORMATION TECH CO LTD +1
View PDF7 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the temperature reaches a certain value, the performance of the PCIE board will decrease or fail

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board card temperature tolerance analysis method
  • Circuit board card temperature tolerance analysis method
  • Circuit board card temperature tolerance analysis method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014]

[0015] The innovation of the present invention lies in the theoretical support of heat transfer. Based on Fourier's law of heat conduction and Newton's law of cold removal, the study of heat conduction from the main control chip of the PCIE board to the surface of the radiator, and then convectively exchanges heat with the cold air flow, the heat is finally The process of being carried away by the cooling airflow. After the inventor’s research, it is found that the thermal conductivity λ of the same PCIE board remains basically unchanged under different ambient temperatures.

[0016] Such as figure 1 As shown, the PCIE board includes a package body 1, a core of the main control chip encapsulated by the package body 1, a thermally conductive material 3 on the surface of the package body 1, and a heat sink 4 attached to the thermally conductive material 3. figure 1 The arrow in shows the heat conduction process. Heat is conducted from the core 2 at the core temperature Tj t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a circuit board card temperature tolerance analysis method. The method is used for testing the maximum heat-resistance temperature of a circuit board card at room temperature. The method comprises the following steps: a temperature difference measurement process, measuring the environment temperature of the card and the core temperature of a main control chip after the circuit board card is stable in temperature at a condition that preset air volume and air pressure of cooling air flow are kept in a working condition, and calculating the difference of the core temperature of the main control chip and the environment temperature of the card; a core temperature increment process; a maximum core temperature measurement process, measuring the core temperature of the main control chip as the maximum core temperature of the main control chip when the circuit board card is nearly ineffective or reduced in performance; and a maximum heat-resistance temperature calculation process, calculating the maximum heat-resistance temperature of the circuit board card based on the measured maximum core temperature of the main control chip and the temperature difference.

Description

Technical field [0001] The invention relates to a temperature resistance analysis method of a circuit board card, in particular to a method for testing the maximum heat resistance temperature of a PCIE board card under room temperature working conditions. Background technique [0002] PCIE (Peripheral Component Interconnect Express) is the latest bus and interface standard. There are many types of PCIE boards. Generally, PCIE boards in servers mainly include SSD (Solid State Drive) cards, external plug-in cards, etc. Different types of cards achieve different functions. There is no uniform standard for the position of these cards in the server. Some are arranged in the front section of the server motherboard and are preferentially cooled; some are distributed at the back of the server motherboard and are cooled by hot air from the CPU radiator. As a result, the PCIE boards are at different card environment temperatures. If the card environment temperature of the PCIE boards is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01R31/28
Inventor 毛士飞高丰王中平
Owner BEIJING JINGDONG SHANGKE INFORMATION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com