Method for Measuring the Micron-Scale Depth of Dimples in Components
A measurement component, micron-level technology, used in measurement devices, instruments, optical devices, etc., can solve the problems of slow detection speed, inconvenient operation, high cost, improve accuracy and traceability, and solve unmeasurable blind spots. , without the effect of damaging hidden dangers
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
specific Embodiment 2
[0037] The characteristics of this embodiment are: according to step 1 and step 2, the depth of part of the concave notch on the standard depth sample block and the corresponding focusing scale difference J 2 -J 1, Step 3. Count the depth of each concave notch on some standard depth samples and the corresponding focusing scale difference J 2 -J 1 , made into the standard depth block scale as shown in Table 2;
[0038] Refer to Table 2 for the scale of standard depth samples
[0039] Focus scale difference / mm 2 3 5 8 Depth / μm 5 8 12 20
[0040] In step 4, the pit reference plane of the part to be tested is placed on the metallographic microscope 1, and by adjusting the focus knob 2 of the metallographic microscope 1, when the arc outline of the pit reference plane is clear, record the focus knob Focus scale J 1 , and then adjust the focus knob 2 of the metallographic microscope 1 again, when the bottom contour of the pit is as clear as the arc co...
specific Embodiment 3
[0042] The characteristics of this embodiment are: the focusing scale J of the focusing knob 2 1 、J 2 Using manual input into the computer, the metallographic microscope 1 measures the horizontal distance h of the concave notch through its own ruler, and manually inputs it into the computer 3 for storage. Other features are the same as those of the specific embodiment 1 and the specific embodiment 2.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com