Semiconductor device and its forming method, SRAM and its forming method
A static random, semiconductor technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve the problems of low yield and poor performance of static random access memory, etc., and achieve the effect of high yield and good performance
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no. 1 example
[0042] This embodiment describes the formation process of a semiconductor device.
[0043] refer to image 3 , providing a semiconductor substrate, the semiconductor substrate includes an active region 200 and two rows of isolation trenches 206 , the active region 200 is located between adjacent isolation trenches 206 .
[0044] Specifically, the material of the semiconductor substrate is silicon, silicon germanium or silicon-on-insulator. In this embodiment, the material of the semiconductor substrate is silicon.
[0045] In this embodiment, forming the semiconductor substrate including the active region 200 and two rows of isolation trenches 206 includes the following steps:
[0046] forming a mask layer 202a on the semiconductor substrate, and forming two rows of openings 204 in the mask layer 202a;
[0047] The semiconductor substrate is etched along the opening 204 to form two rows of isolation trenches 206 in the semiconductor substrate.
[0048] Wherein, the material ...
no. 2 example
[0082] refer to Figure 10 , is a top view of the SRAM formed in this embodiment, which includes the semiconductor device formed in the first embodiment.
[0083] The method for forming the SRAM provided by this embodiment, when forming Figure 9 After semiconductor devices, it also includes: Figure 9 The active region 200 on both sides of the middle gate structure is implanted with ions to form a source 222 and a drain 224 . The conductivity type of the source 222 and the drain 224 can be either N-type or P-type. The methods for forming the source 222 and the drain 224 are well known to those skilled in the art, and will not be described in detail here.
[0084] Correspondingly, refer to Figure 10 , this embodiment also provides a static random access memory, which includes Figure 9 In addition to the semiconductor device, it also includes a source 222 and a drain 224 .
[0085] The SRAM in this embodiment includes the semiconductor device in the first embodiment. Since...
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