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Device for crushing PCB photosensitive film plate-type raw material

A raw material crushing and photosensitive film technology, which is applied in grain processing and other directions, can solve the problems of undurable cutting tools and low crushing efficiency, and achieve the effect of low equipment manufacturing cost and improved crushing efficiency

Inactive Publication Date: 2015-04-08
WUXI DERBELL PHTO ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is: to overcome the technical problems of undurable knives and low crushing efficiency in the prior art, and to provide a photosensitive film plate type raw material crushing device for PCB

Method used

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  • Device for crushing PCB photosensitive film plate-type raw material
  • Device for crushing PCB photosensitive film plate-type raw material

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Embodiment Construction

[0021] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0022] Such as Figure 1~2 As shown, a photosensitive film plate type raw material crushing device for PCB includes a crushing bucket 3 and a crushing assembly;

[0023] The crushing assembly includes a blade assembly and a vibrator block 2 assembly, the two ends of the crushing barrel 3 are sealed, a feed port 4 is arranged at the sealed end of the crushing barrel 3, and a discharge port 5 is arranged at the sealed end of the crushing barrel 3 , the blade assembly includes a main shaft 6 and a helical blade 7 arranged on the main shaft 6, the helical axis of the helical blade 7 is coaxial with the axis of the main shaft 6;

[0024] The vibrator block 2 asse...

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Abstract

The invention discloses a device for crushing a PCB photosensitive film plate-type raw material. The device comprises a crushing barrel and a crushing assembly. The crushing assembly comprises a blade assembly and an oscillator block assembly. Two ends of the crushing barrel are sealed. One sealed end of the crushing barrel is provided with a material inlet, and the other sealed end of the crushing barrel is provided with a material discharge outlet. The blade assembly comprises a main rotation shaft and screw blades arranged on the main rotation shaft. The screw axis of the screw blades and the axis of the main rotation shaft are the same. The oscillator block assembly comprises several arce oscillator blocks and an oscillator shock excitation barrel. The oscillator shock excitation barrel is arranged on the outer wall of the crushing barrel. The inner wall of the shock excitation barrel is elastically connected to the outer wall of the crushing barrel by a spring. One end of the oscillator block is fixed to the inner wall of the shock excitation barrel and the other end of the oscillator block goes through the wall of the crushing barrel and extends to the screw blades. A feeding gap is arranged between the screw blades and the oscillator block. The contact surface of the oscillator block and the screw blades is arc. The shock excitation barrel is provided with a shock excitation motor.

Description

technical field [0001] The invention relates to a photosensitive film plate type raw material crushing device for PCB, which belongs to a photosensitive film material crushing mechanism. Background technique [0002] The development of modern engineering technology and the transformation of the new material industry require many raw materials and products in the state of powder. The pulverizer is the main powder-making equipment for obtaining fine powder. Especially nowadays, environmental protection and resource reuse are emphasized. The finished products of many industrial products After use, it can be recycled into raw materials, which can increase the production cost of the company. The waste materials after production of the photosensitive film can be recycled. At present, the shredder used uses the moving knife and the fixed knife to cut each other to realize the mutual cutting of the moving knife and the fixed knife. , so as to crush the photosensitive film, the dista...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B02C18/08B02C18/16B02C18/18B02C19/16
CPCB02C18/14B02C18/16B02C18/18B02C19/16
Inventor 朱贤红
Owner WUXI DERBELL PHTO ELECTRONICS MATERIAL
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