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An organic light emitting diode display substrate and packaging method thereof

A technology for light-emitting diodes and display substrates, which is applied in the manufacture of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc. It can solve problems such as barrier film damage, achieve the effects of reducing damage and improving reliability

Active Publication Date: 2017-04-05
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides a flexible OLED display substrate and its packaging method to solve the problem that the existing OLED display substrate packaged with a barrier film is easily damaged by the barrier film when it is bent or squeezed

Method used

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  • An organic light emitting diode display substrate and packaging method thereof
  • An organic light emitting diode display substrate and packaging method thereof

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Embodiment Construction

[0025] An embodiment of the present invention provides an organic light emitting diode display substrate, including: a base substrate; an organic light emitting diode device disposed on the base substrate; and an organic light emitting diode device disposed on the organic light emitting diode device for packaging the A transparent protective film for an organic light emitting diode device, a spacer is arranged between the organic light emitting diode device and the transparent protective film.

[0026] By disposing spacers between the organic light emitting diode device and the transparent protective film, when the organic light emitting diode display substrate is bent or squeezed, the force between the transparent protective film and the organic light emitting diode device will be concentrated on On the spacer, and the stressed spacer is usually located on the raised non-luminous area (such as the pixel definition layer area) on the organic light emitting diode display substra...

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Abstract

The present invention provides an organic light emitting diode display substrate and a packaging method thereof. The organic light emitting diode display substrate comprises: a base substrate; an organic light emitting diode device disposed on the base substrate; and an organic light emitting diode device disposed on the organic light emitting diode device A transparent protective film for encapsulating the organic light emitting diode device, and a spacer is provided between the organic light emitting diode device and the transparent protective film. Since the spacer is arranged between the transparent protective film and the organic light emitting diode device, when the organic light emitting diode display substrate is bent or squeezed, the transparent protective film will be far away from the organic light emitting diode device, which can reduce the relative displacement of the transparent protective film The damage caused to the organic light emitting diode device improves the reliability of the organic light emitting diode display substrate.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an organic light emitting diode (OLED) display substrate and a packaging method thereof. Background technique [0002] For OLED display technology, encapsulation is a crucial process, which directly affects the display quality and service life of OLED display devices. There are also various packaging methods, among which barrier film packaging is the mainstream direction of research and development at present. Its manufacturing process is simple, its transmittance is high, and its material flexibility is good, so it can be applied to flexible OLED display devices. Therefore, the barrier film encapsulation method has attracted attention from all walks of life. [0003] The schematic diagram of the structure of the barrier film package is shown in figure 1 As shown, the barrier film packaging needs to be carried out in a vacuum environment, and the barrier film 20 is bonded to t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L27/32H01L51/56
CPCH10K59/00H10K50/8428H10K50/844H10K71/00
Inventor 石领史世明
Owner BOE TECH GRP CO LTD