Tray origin positioning system and tray origin positioning method

Abstract

The invention provides a tray origin positioning system and a tray origin positioning method. The tray origin positioning method includes the steps: S1, driving a tray to rotate, transmitting a detection signal to a tray at a preset detection point, and receiving a reflected signal which is reflected when the upper surface of the tray rotates to the position corresponding to the preset detection point; S2, determining a reflecting portion reaching the position corresponding to the preset detection point first according to the reflected signal reflected by the upper surface of the tray, determining a rotating direction of the tray according to the preset positional relation of the preset detection point and the reflecting portion, judging whether the origin position is located in the forward direction of the rotating direction of the tray or not according to the corresponding relation of the position of the reflecting portion on the tray and the origin position, if yes, controlling a driving unit to drive the tray to continue rotating to the origin position, and if not, controlling the driving unit to drive the tray to reversely rotate to the origin position. By the tray origin positioning method, rate of tray origin positioning can be improved, and accordingly working efficiency is improved.

Description

technical field [0001] The invention belongs to the field of semiconductor equipment manufacturing, and in particular relates to a tray origin positioning [0002] System and pallet origin positioning method. Background technique [0003] Metal-organic Chemical Vapor Deposition (MOCVD for short) is a new type of vapor phase growth technology developed on the basis of vapor phase epitaxial growth. Specifically, the basic principle of MOCVD technology is to use organic compounds of group III and group II elements and hydrides of group V and group VI elements as raw materials for crystal growth, and perform vapor phase epitaxy on the processed workpiece in a thermal decomposition reaction mode, so that Various III-V and II-VI compound films are formed on the surface of the processed workpiece. After the process is completed, the automatically controlled manipulator is usually used to load and unload the processed workpiece. Before the loading and unloading process, the pallet...

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