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Radio module and relavent manufacturing method

A radio and electrical connection technology, applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of increased weight and cost, difficulty in reducing board size and scale, and less flexibility, so as to achieve modular design and reduce The Effect of Size and Scale

Inactive Publication Date: 2015-04-15
ERICSSON (CHINA) COMMUNICATION COMPANY LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, for single-sided assembly boards, all components are assembled on the front surface of the board, which makes it difficult to reduce the size and dimensions of the board
For double-sided assembly boards, while offering relatively small size and dimensions, the grounding and cooling performance is not good enough for radio circuits
The separate EMC cover necessary for shielding increases the weight and cost of a unit consisting of one or more boards, for both single-sided and double-sided boards
Also, in existing solutions, all components are assembled on one board (single-sided assembly board or double-sided assembly board), which results in less flexibility when encountering failure issues or function / performance upgrades

Method used

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  • Radio module and relavent manufacturing method
  • Radio module and relavent manufacturing method
  • Radio module and relavent manufacturing method

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Embodiment Construction

[0018] Embodiments of the present invention will be described below with reference to the accompanying drawings. In the following description, numerous specific details are illustrated in order to provide a more complete understanding of the present invention. However, it is clear to those skilled in the art that the present invention may be implemented without these details. Furthermore, it should be understood that the invention is not limited to the specific embodiments as described herein. On the contrary, any arbitrary combination of the following features and elements, whether they relate to different embodiments or not, can be considered to implement and realize the present invention. Accordingly, the following aspects, features, embodiments and advantages are for illustration only and should not be construed as elements or limitations of the appended claims unless otherwise expressly stated in the claims. Throughout the drawings, the same reference numbers are used t...

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Abstract

A radio module comprises a top board (110) with all components mounted on a front surface (111) and a metal substrate on a back surface (112); a bottom board (120) with all components mounted on a front surface (121) and a metal substrate on a back surface (122), wherein the bottom board (120) is arranged so that the front surface (121) of the bottom board (120) is opposite to the front surface (111) of the top board (110); and at least one shielding board (130) provided between the top board (110) and the bottom board (120) with certain vertical spacing. The top board (110), the bottom board (120), and the at least one shielding board (130) are arranged to be substantially in alignment in a vertical direction and be fastened with one another. A board-board electrical connection (140-1, 140-2) is established at least between the top board (110) and the bottom board (120).

Description

technical field [0001] Embodiments of the present invention generally relate to printed circuit boards (PCBs), and in particular to radio modules operatively connected to the motherboard. Background technique [0002] Single-sided mounted radio boards and double-sided mounted radio boards are widely used in almost all radio units today. [0003] Generally, a single-sided mounted PCB with all its components mounted on its front surface and a metal substrate formed on its back surface can provide more efficient grounding and cooling performance. A double-sided assembled PCB having its components mounted on both its front and rear surfaces usually imparts a relatively small PCB size and board dimensions. Here, components of the PCB as mentioned above may include active and passive components such as resistors, capacitors, inductors, inverters, filters, mechanical switches, relays, and the like. [0004] For radio PCBs, a good ground connection is important in order to have a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00
CPCH05K9/0024H05K1/0209H05K3/0061H05K2201/042H05K2201/066H05K2201/0715H05K2201/10371H05K2201/10098H05K1/144
Inventor 廖纪昌孙宁
Owner ERICSSON (CHINA) COMMUNICATION COMPANY LTD