Apparatus for holding semiconductor devices
A technology for semiconductors and devices, which is applied in the field of clamping semiconductor devices, can solve the problems that the maximum torque value cannot accurately reflect the true value of the pressing force, the assembly process is complicated, and the assembly efficiency is affected, so as to omit the readjustment process and the assembly process. The effect of a simple, simple assembly process
Active Publication Date: 2018-01-09
ZHUZHOU CRRC TIMES SEMICON CO LTD
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Problems solved by technology
[0004] However, due to the influence of the bolt 26 processing technology, friction and other factors, the maximum torque value often cannot accurately reflect the true value of the press-fitting force, so it needs to be detected by a pressure sensor, and the device 20 should be further adjusted according to the detection results
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[0024] The present invention will be further described below in conjunction with accompanying drawing.
[0025] figure 2 It shows that the device 10 for clamping a semiconductor device according to the present invention can not only be used for clamping and fixing the semiconductor device 2 , but also can dissipate heat from the semiconductor device 2 . The device 10 includes a base 3 for placing the semiconductor device 2 , and a pressing plate 4 arranged above the semiconductor device 2 . The pressing plate 4 is connected to the base 3 through the distance adjustment unit 5 . The distance adjusting unit 5 can adjust the distance between the pressure plate 4 and the base 3, which can be realized by many structures, such as the cooperation between the bolt and the internal thread, the cooperation between the bolt and the nut or the cooperation between the lead screw and the thread.
[0026] Such as figure 2 As shown, the distance adjustment unit 5 of the present embodimen...
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The invention relates to an apparatus for clamping a semiconductor device. The apparatus comprises: a pedestal, which is used for placing a semiconductor device; a pressing plate, which is arranged above the semiconductor device and is connected with the pedestal by a distance adjusting unit; and an elastomer, which is arranged between the pressing plate and the semiconductor device and is used for realizing press fitting of the semiconductor device. The distance adjusting unit is configured to be able to adjust the distance between the pedestal and the pressing place and enable the compression value of the elastomer to be changed into a set value, so that the elastic force of the elastomer is equal to the press fitting force needed by the semiconductor device. According to the invention, compared with the prior art, the assembling process of the apparatus is simpler, so that the time and effort are saved and the assembling efficiency is improved.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a device for clamping semiconductor devices. Background technique [0002] Semiconductor devices are planar devices, which are mainly composed of chips, molybdenum sheets, tube covers and tube sockets. These components are assembled together through a specific positioning method, so that there is a large contact thermal resistance and electrical resistance between the components. In order to ensure that the semiconductor device can work normally, each component needs to be clamped by the clamping device, but it is necessary to strictly control the press-fit force of the device to clamp the semiconductor device, neither too large nor too small, too large pressure Broken chips, too small will increase contact thermal resistance and electrical resistance. [0003] figure 1 The existing device 20 for clamping semiconductor devices is shown, and the device 20 includes an upp...
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IPC IPC(8): H01L21/687
CPCH01L21/68714
Inventor 刘应熊辉颜骥任亚东谢腾飞孙文伟唐豹郭金童
Owner ZHUZHOU CRRC TIMES SEMICON CO LTD