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Display device

A display device and encapsulation layer technology, applied in semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve problems affecting the working life of the display device, aging of the display device, and inability to transfer heat in time

Active Publication Date: 2015-04-22
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Self-luminous display devices can be divided into top emission mode and bottom emission mode according to the different light emitting directions of the display device. When the above-mentioned opaque or translucent heat dissipation film is used to dissipate heat from the display device, the heat dissipation film can only be placed on the non-transparent side of the display device. In this way, the heat generated by the light-emitting surface of the display device can only be transferred from the non-light-emitting surface of the display device. The heat on the light-emitting surface of the display device cannot be transferred out in time, which will affect the normal operation of the display device and cause the display device Accelerated aging, affecting the working life of the display device

Method used

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Embodiment Construction

[0025] figure 1 It is a cross-sectional view of the basic structure of AMOLED in the prior art. AMOLED 100 generally includes a thin film transistor 120, an organic light emitting diode 130, and an encapsulation layer 140 sequentially arranged on a substrate 110. The organic light emitting diode 130 includes an anode layer 131, an organic functional layer 132 and a cathode. Layer 133. The organic functional layer 132 includes an organic light emitting layer 1321 . In order to improve the luminous efficiency of the organic light emitting diode 130, the organic functional layer 132 further includes a hole transport layer 1322 and a hole injection layer 1324 which are sequentially arranged between the organic light emitting layer 1321 and the anode layer 131, and which are sequentially arranged between the organic light emitting layer 1321 and the anode layer 131. The electron transport layer 1323 and the electron injection layer 1325 between the cathode layers 133 .

[0026] A...

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Abstract

The invention discloses a display device. The display device comprises a thin film transistor, an anode layer, an organic functional layer, a cathode layer and an encapsulation layer, wherein the thin film transistor, the anode layer, the organic functional layer, the cathode layer and the encapsulation layer are sequentially arranged on a substrate, and the organic functional layer comprises an organic luminous layer. The display device further comprises a heat dissipation layer which is arranged between the encapsulation layer and the organic luminous layer or between the organic luminous layer and the substrate and is in a grid shape, and the grid line width of the heat dissipation layer does not influence display of a visual light-emitting element.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display device with heat dissipation function. Background technique [0002] At present, various heat dissipation materials have been widely used in various industries, and different types of heat dissipation materials have different properties. The current heat dissipation film is mainly made of metal or graphite. The heat dissipation material made of metal has excellent heat dissipation performance due to its good thermal conductivity; and the heat dissipation material made of graphite has excellent heat dissipation performance due to its good ductility. Excellent plasticity. The heat dissipation diaphragms produced from the above two materials according to the existing manufacturing method of heat dissipation films are mainly opaque diaphragms. Although heat dissipation films are widely used in display products, opaque or translucent heat dissipation films cannot be used ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L23/367H01L23/373
Inventor 丁立薇张小宝张秀玉朱晖
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD