Film formation method of induction material in deep trench

Abstract

The invention discloses a film forming method for an induction material in a deep trench. The method comprises the following steps: (1), a hard mask is grown on a silicon substrate; (2), the hard mask is coated with photoresist to form a photolithographic window of the deep trench; (3), the deep trench is formed through photolithographic etching; (4), the hard mask is removed through wet etching; (5), the induction material is deposited; (6), a photoresist filled type material is spin-coated twice, and still standing is performed for 10-20 s after the second-time spin-coating, and then baking is performed; (7), the photoresist is applied, exposed and developed; and (8), a final pattern is formed through etching. According to optimization of a coating menu, standing time is prolonged by 10-20 s in the final step of coating, the photoresist flows into the deep trench from the part near a position above the deep trench, by means of the shape following feature of the photoresist, the side wall and fillet parts of the trench are protected and a pattern similar to the trench is kept, so that one coating step is reduced, and the cost and follow-up etching time are reduced under the premise that the device performance is not influenced.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a method for forming a specific shape-sensitive material film on the surface of a deep groove in a micromechanical system. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS) is a multidisciplinary frontier research field developed on the basis of microelectronics technology. As far as the semiconductor industry is concerned, the integration of MEMS and production process technology will bring a great leap forward for the system single chip. In the future, it is expected to integrate subsystems such as audio, light, chemical analysis, pressure, and temperature sensing in a single chip, so that chips with sensory functions such as human eyes, nose, ears, and skin can be developed; And the ability to control, it surpasses the ability of the human body. [0003] At present, there are three main technologies commonly used to manufacture MEMS devices...

AI Technical Summary

Problems solved by technology

Since this method needs to apply glue three times, not only a large amount of material is required, but also a large amount of working time is required, so the production cost of the device will be increased.

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