Unlock instant, AI-driven research and patent intelligence for your innovation.

Adhesive dispensing device for IC chip

A technology for dispensing devices and chips, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as scrapping of IC chips, and achieve the effect of avoiding scrapping and ensuring processing quality.

Inactive Publication Date: 2015-05-13
CHIZHOU RICHSEMI ELECTRONICS
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide an IC chip dispensing device to solve the problem of scrapped IC chips

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesive dispensing device for IC chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] In the following, numerous specific details are set forth in order to provide a thorough understanding of the concepts underlying the described embodiments. It will be apparent, however, to one skilled in the art that the described embodiments may be practiced without some or all of these specific details. In other instances, well known processing steps have not been described in detail.

[0021] Such as figure 1 As shown, it includes a support frame 1, a support seat 2, a support plate 3, a connecting rod 4, a rubber storage device 5, a cylinder 6, a positioning seat 7, and a limit block 8. The support seat 2 is located at the left end of the top center of the support frame 1 , the two are threaded, the support plate 3 is located at the center of the right side of the support base 2, and it is threaded with the support frame 1, and the connecting rod 4 is located at the center of the right end of the support base 2, and it is movably connected with the support plate 3...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an adhesive dispensing device for an IC chip. The adhesive dispensing device for the IC chip comprises a support frame, a support seat, a support plate, a connecting rod, an adhesive storage device, a cylinder, a locating seat and a limit block. Compared with the prior art, an adhesive dispensing die is placed in the locating seat, the cylinder pushes the locating seat to the center of the lower end of the adhesive storage device, the electricity is charged through an electromagnetic relay, a flow rate regulating switch is turned on, liquid flows into the adhesive dispensing die through the flow rate regulating switch, the IC chip is placed on the adhesive and fixed to avoid dislocation, the processing quality of the next procedure is guaranteed, and the scrapping is avoided.

Description

technical field [0001] The invention relates to a dispensing device, in particular to an IC chip dispensing device. Background technique [0002] With the development of science and technology, electronic products are becoming more and more advanced, and the volume is getting smaller and smaller. The root of the development of electronic products lies in the extensive use of IC chips. Since the electronic chips are extremely small, they need to be encapsulated with epoxy ester before use. It makes its volume bigger and easier to use, and the chip body is extremely small, and it is not well positioned in the epoxy ester, which causes the chip to be cut and scrapped when the epoxy ester is cut into small pieces. In view of the above-mentioned defects, it is necessary to design a kind of IC chip dispensing device. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an IC chip dispensing device to solve the problem of s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56
CPCH01L21/67126H01L21/56H01L21/68
Inventor 陈友兵徐和平宋越
Owner CHIZHOU RICHSEMI ELECTRONICS