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Cooling and heating floor

A floor, cooling and heating technology, applied in the field of cooling and heating floors, can solve the problems of poor thermal conductivity of the floor and the inability of water pipe heat to transfer quickly, and achieve the effect of a flat overall structure, a simple structure, and rapid and uniform heat transfer.

Inactive Publication Date: 2015-05-27
KOM FLOORING SUZHOU
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, under normal circumstances, the thermal conductivity of the floor is poor, and the heat of the water pipe cannot be quickly transferred to the entire floor.

Method used

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  • Cooling and heating floor
  • Cooling and heating floor
  • Cooling and heating floor

Examples

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Embodiment Construction

[0023] The present invention will be further described in detail below in conjunction with specific embodiments. It should be understood that these embodiments are used to illustrate the basic principles, main features and advantages of the present invention, and the present invention is not limited by the scope of the following embodiments. The implementation conditions used in the examples can be further adjusted according to specific requirements, and the implementation conditions not specified are usually conditions in routine experiments.

[0024] The figure shows a heating and cooling floor 1 of the present invention. The heating and cooling floor 1 includes a floor body 2. The upper surface of the floor body 2 is provided with a water pipe installation groove 21 for laying water pipes 5, covering the The heat conducting plate 3 above the floor body 2 is made of metal material. At least one heat-conducting groove 31 is formed on the lower surface of the heat-conducting p...

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Abstract

The invention discloses a cooling and heating floor. The cooling and heating floor comprises a floor body, wherein water pipe mounting grooves used for paving water pipes are formed in the upper surface of the floor body; the floor further comprises a heat conduction plate which covers the floor body; at least one heat conduction groove is formed in the lower surface of the heat conduction plate; the mounting grooves and the heat conduction grooves are interpenetrated. According to the cooling and heating floor, a layer of metal heat conduction plate covers the floor body, so that the heat transmission between the water pipes and the floor is more uniform; the overall structure of the floor is more flat; the floor is high in compression resistance, is not deformed after being used or loaded for a long time, and is simple in structure; the heat conduction grooves are formed in the lower surface of the metal heat conduction plate; the heat conduction grooves and the water pipe mounting grooves are intercrossed and interpenetrated; the heat transmission of the floor is more quick and uniform; an outer layer made of wood material is paved at the uppermost layer of the floor, so that the comfort level of the floor is improved.

Description

technical field [0001] The invention relates to a heating and cooling floor. Background technique [0002] In the prior art, some heating and cooling floors use water pipes laid on the floor to heat or cool the floor, thereby adjusting the indoor temperature. But in general, the thermal conductivity of the floor is poor, and the heat of the water pipe cannot be quickly transferred to the entire floor. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a heating and cooling floor. [0004] In order to solve the above technical problems, the present invention takes the following technical solutions: [0005] A heating and cooling floor, which includes: a floor body, the upper surface of which is provided with a water pipe installation groove for laying water pipes, characterized in that: the floor also includes a heat conduction plate, and the heat conduction plate Abo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/02E04F15/10E04F15/06E04F15/18F24D3/16
Inventor 吴传明
Owner KOM FLOORING SUZHOU
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