PCB jigsaw method and system

A panel and substrate technology, applied in the field of PCB panel method and system, can solve the problems of slow speed, high error rate, low efficiency, etc., and achieve the effect of large application range, good compatibility, and reduced manual intervention

Active Publication Date: 2018-09-14
VAYO SHANGHAI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a method and system for PCB panel assembly, which is used to solve the problems of slow speed, low efficiency and high error rate in the PCB panel operation in the prior art.

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  • PCB jigsaw method and system
  • PCB jigsaw method and system
  • PCB jigsaw method and system

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Embodiment Construction

[0021] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0022] It should be noted that the diagrams provided in the following embodiments are only schematically illustrating the basic ideas of the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in ...

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Abstract

The invention provides a PCB (printed circuit board) jointing method and a PCB jointing system. The PCB jointing method comprises the following steps: reading a jointed board figure and a substrate figure which are input, and displaying the figures; integrating the substrate figure into the jointed board figure; generating board jointing data according to the integrated substrate figure and jointed board figure for board jointing so as to solve the problems of low speed, low efficiency, high error rate and the like in a PCB jointing operation in the prior art.

Description

technical field [0001] The invention relates to the technical field of surface assembly, in particular to a PCB splicing method and system applied to SMT equipment. Background technique [0002] When designing PCB circuit boards in the electronics manufacturing industry, for mobile phones and other boards with relatively small sizes, they will be designed as multi-connected boards (multi-connected boards), also called jigsaw boards. There are several reasons for doing multiple boards: 1. PCB size is too small and SMT-related equipment cannot be produced; 2. Materials can be saved after panelization; 3. Production efficiency can be improved after panelization. There are two types of panels in the industry: 1. Single-substrate panelization, and 2. Multi-substrate panelization. Among them, there is a matrix panel in the single substrate panel, which is characterized in that the panel spacing in the X direction is the same, and the panel spacing in the Y direction is the same. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/36H05K3/30
CPCH05K3/0005H05K3/36
Inventor 钱胜杰朱忠良刘丰收刘继硕
Owner VAYO SHANGHAI TECH
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